74HC259DB datasheet(2/23 Pages) NXP

2 / 23 page

74HC_HCT259

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Product data sheet

Rev. 5 — 7 August 2012

2 of 22

NXP Semiconductors

74HC259; 74HCT259

8-bit addressable latch

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V

 CDM JESD22E exceeds 1000 V

 Multiple package options

 Specified from

40 C to +85 C and from 40 C to +125 C

Ordering information

Functional diagram

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

74HC259N

40 C to +125 C

DIP16

plastic dual in-line package; 16 leads (300 mil)

SOT38-4

74HCT259N

74HC259D

40 C to +125 C

SO16

plastic small outline package; 16 leads;

body width 3.9 mm

SOT109-1

74HCT259D

74HC259DB

40 C to +125 C

SSOP16

plastic shrink small outline package; 16 leads; body

width 5.3 mm

SOT338-1

74HCT259DB

74HC259PW

40 C to +125 C

TSSOP16

plastic thin shrink small outline package; 16 leads;

body width 4.4 mm

SOT403-1

74HCT259PW

74HC259BQ

40 C to +125 C

DHVQFN16

plastic dual in-line compatible thermal enhanced very

thin quad flat package; no leads; 16 terminals;

body 2.5

 3.5  0.85 mm

SOT763-1

74HCT259BQ

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

mna573

mna572

9,10D

G10

C10

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