NVT2004TL datasheet(33/33 Pages) PHILIPS

33 / 33 page

NXP Semiconductors

NVT2003/04/06

Bidirectional voltage-level translator

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 19 February 2014

Document identifier: NVT2003_04_06

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

20. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

3.1

Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

5.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.1.1

3-bit in TSSOP10 package . . . . . . . . . . . . . . . . 3

5.1.2

4-bit in HXSON12 package. . . . . . . . . . . . . . . . 3

5.1.3

6-bit in TSSOP16, DHVQFN16

and HVQFN16 packages . . . . . . . . . . . . . . . . . 4

5.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

Functional description . . . . . . . . . . . . . . . . . . . 5

6.1

Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Application design-in information . . . . . . . . . . 6

7.1

Enable and disable . . . . . . . . . . . . . . . . . . . . . . 6

7.2

Bidirectional translation . . . . . . . . . . . . . . . . . . 8

7.3

Bidirectional level shifting between two

different power domains nominally

at the same potential . . . . . . . . . . . . . . . . . . . . 8

7.4

How to size pull-up resistor value . . . . . . . . . . . 9

7.5

How to design for maximum frequency

operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12

Recommended operating conditions. . . . . . . 13

Static characteristics . . . . . . . . . . . . . . . . . . . . 13

Dynamic characteristics . . . . . . . . . . . . . . . . . 15

11.1

Open-drain drivers . . . . . . . . . . . . . . . . . . . . . 15

Performance curves . . . . . . . . . . . . . . . . . . . . 16

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17

Soldering of SMD packages . . . . . . . . . . . . . . 22

14.1

Introduction to soldering . . . . . . . . . . . . . . . . . 22

14.2

Wave and reflow soldering . . . . . . . . . . . . . . . 22

14.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22

14.4

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23

Soldering: PCB footprints. . . . . . . . . . . . . . . . 25

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30

Legal information. . . . . . . . . . . . . . . . . . . . . . . 31

18.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31

18.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

18.3

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

18.4

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Contact information. . . . . . . . . . . . . . . . . . . . . 32

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

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