LM5037

SNVS578D – NOVEMBER 2008 – REVISED MAY 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

–0.3

105

VCC, OUTA, OUTB

–0.3

16

V

CS

–0.3

1.0

UVLO, FB, RT2, RT1/SYNC, RAMP, SS, REF

–0.3

7

Output voltage

–0.3

7

V

−65

50

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All input voltage ratings apply w/r/t GND.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Supply input voltage range

13

100

V

VCC

External voltage applied to VCC

8

15

V

Operating junction temperature

–40

125

°C

6.4 Thermal Information

LM5037

PW (TSSOP)

UNIT

16 PINS

Junction-to-ambient thermal resistance

99.9

°C/W

Junction-to-case (top) thermal resistance

32.7

°C/W

Junction-to-board thermal resistance

45.8

°C/W

Junction-to-top characterization parameter

2.0

°C/W

Junction-to-board characterization parameter

45.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2008–2015, Texas Instruments Incorporated

Product Folder Links: LM5037