STM32F101XF datasheet(50/117 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F101xF, STM32F101xG

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DocID16553 Rev 5

Low-speed external user clock generated from an external source

The characteristics given in Table 22 result from tests performed using an low-speed

external clock source, and under ambient temperature and supply voltage conditions

summarized in Table 10.

Table 21. High-speed external user clock characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fHSE_ext

User external clock source

frequency(1)

1. Guaranteed by design.

MHz

VHSEH

OSC_IN input pin high level

voltage

0.7VDD

-VDD

VHSEL

OSC_IN input pin low level

voltage

VSS

-0.3VDD

tw(HSE)

OSC_IN high or low time(1)

tr(HSE)

tf(HSE)

OSC_IN rise or fall time(1)

Cin(HSE)

OSC_IN input capacitance(1)

DuCy(HSE) Duty cycle

OSC_IN Input leakage current

VSS ≤ VIN ≤ VDD

±1

µA

Table 22. Low-speed user external clock characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fLSE_ext

User external clock source

frequency(1)

1. Guaranteed by design.

32.768

1000

kHz

VLSEH

OSC32_IN input pin high

level voltage

-0.7VDD

-VDD

VLSEL

OSC32_IN input pin low level

voltage

-VSS

-0.3VDD

tw(LSE)

OSC32_IN high or low time(1)

-450

tr(LSE)

tf(LSE)

OSC32_IN rise or fall time(1)

Cin(LSE)

OSC32_IN input

capacitance(1)

DuCy(LSE) Duty cycle

OSC32_IN Input leakage

current

VSS ≤ VIN ≤ VDD

±1

µA

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