6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

0

20

V

Signal input pins

Common-mode voltage (3)

(V–) – 0.5

(V+) + 0.5

V

Differential voltage (3)

V

Current (3)

–10

10

mA

Output short-circuit (2)

Continuous

–55

150

°C

150

°C

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to ground, one amplifier per package.

(3)

Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

2.7

16

V

Input voltage range

(V–) – 0.1

(V+) + 0.1

V

Specified ambient temperature

–40

125

°C

6.4 Thermal Information for Single Channel

THERMAL METRIC (1)

TLV9151-Q1

UNIT

DBV (2)

(SOT-23)

5 PINS

Junction-to-ambient thermal resistance

TBD

°C/W

Junction-to-case (top) thermal resistance

TBD

°C/W

Junction-to-board thermal resistance

TBD

°C/W

Junction-to-top characterization parameter

TBD

°C/W

Junction-to-board characterization parameter

TBD

°C/W

Junction-to-case (bottom) thermal resistance

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9151-Q1.

TLV9152-Q1, TLV9154-Q1

SBOSA23B – MAY 2020 – REVISED MARCH 2021

www.ti.com

6

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Product Folder Links: TLV9152-Q1 TLV9154-Q1