6.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

TLV9152-Q1

Unit

D(2)

(SOIC)

DGK

(VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

TBD

176.5

°C/W

Junction-to-case (top) thermal resistance

TBD

68.1

°C/W

Junction-to-board thermal resistance

TBD

98.2

°C/W

Junction-to-top characterization parameter

TBD

12.0

°C/W

Junction-to-board characterization parameter

TBD

96.7

°C/W

Junction-to-case (bottom) thermal resistance

TBD

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9152-Q1.

6.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TLV9154-Q1

UNIT

D (2)

(SOIC)

DYY (2)

(SOT-23)

PW (2)

(TSSOP)

14 PINS

14 PINS

14 PINS

Junction-to-ambient thermal resistance

TBD

110.7

118.0

°C/W

Junction-to-case (top) thermal resistance

TBD

55.9

47.6

°C/W

Junction-to-board thermal resistance

TBD

35.3

60.9

°C/W

Junction-to-top characterization parameter

TBD

2.3

6.0

°C/W

Junction-to-board characterization parameter

TBD

35.1

60.4

°C/W

Junction-to-case (bottom) thermal resistance

TBD

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9154-Q1.

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TLV9152-Q1, TLV9154-Q1

SBOSA23B – MAY 2020 – REVISED MARCH 2021

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Product Folder Links: TLV9152-Q1 TLV9154-Q1