HMC815BLC5TR-R5 datasheet(4/30 Pages) AD

4 / 30 page

HMC815B

Data Sheet

Rev. 0 | Page 4 of 30

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Drain Bias Voltage (VDD1, VDD2, VDD3)

5.5 V

Input Power

LO (LOIN)

15 dBm

IF (IF1, IF2)

20 dBm

IF Source/Sink Current

3 mA

Moisture Sensitivity Level (MSL) Rating1

MSL3

Maximum Junction Temperature

175°C

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Reflow Temperature

260°C

Electrostatic Discharge Sensitivity

Human Body Model (HBM)

250 V

Field Induced Charged Device Model

(FICDM)

1250 V

See the Ordering Guide section.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

E-32-11

46.4

46.7

°C/W

Thermal impedance simulated values are based on JEDEC 2S2P test board

with 5 × 5 thermal vias. A cold plate is attached to the bottom side of the

PCB using 100 µm tin (3.56 W/mK). Refer to JEDEC standard JESD51-2 for

additional information.

ESD CAUTION

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