Data Sheet

HMC815B

Rev. 0 | Page 5 of 30

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

17

1

3

4

2

NIC

PACKAGE

BASE

GND

NIC

NIC

NIC

5

6

NIC

VDD1

7

NIC

8

NIC

NIC

HMC815B

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NOT INTERNALLY CONNECTED. THESE PINS ARE NOT CONNECTED INTERNALLY.

HOWEVER, THESE PINS CAN BE CONNECTED TO RF/DC GROUND WITHOUT

AFFECTING PERFORMANCE.

2. EXPOSED PAD. CONNECT THE EXPOSED PAD TO A LOW IMPEDANCE

THERMAL AND ELECTRICAL GROUND PLANE.

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1 to 5, 7, 8, 11, 16, 17, 19,

20, 22 to 28

NIC

Not Internally Connected. These pins are not connected internally. However, these pins can be

connected to RF/dc ground without affecting performance.

6

VDD1

Power Supply Voltage for the LO Amplifier. See Figure 3 for the interface schematic. Refer to the

typical application circuit (see Figure 104) for the required external components.

9

LOIN

Local Oscillator Input. See Figure 4 for the interface schematic. This pin is ac-coupled and

matched to 50 Ω.

10, 13, 15, 30, 32

GND

Ground Connect. See Figure 5 for the interface schematic. These pins and the exposed pad must

be connected to RF/dc ground.

12

VGG

Gate Voltage for the RF Amplifier. See Figure 6 for the interface schematic. Refer to the typical

application circuit (see Figure 104) for the required external components.

14

RFOUT

Radio Frequency Output. See Figure 7 for the interface schematic. This pin is ac-coupled and

matched to 50 Ω.

18, 21

VDD3, VDD2

Power Supply Voltage for the RF Amplifier. See Figure 8 for the interface schematic. Refer to the

typical application circuit (see Figure 104) for the required external components.

29, 31

IF1, IF2

Quadrature Intermediate Frequency Inputs. See Figure 9 for the interface schematic. For

applications not requiring operation to dc, use an off chip dc blocking capacitor. For operation

to dc, these pins must not source or sink more than 3 mA of current or device malfunction and

failure can result.

EPAD

Exposed Pad. Connect the exposed pad to a low impedance thermal and electrical ground

plane.