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ADRF5060BCCZN-R7 Datenblatt(PDF) 5 Page - Analog Devices |
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ADRF5060BCCZN-R7 Datenblatt(HTML) 5 Page - Analog Devices |
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5 / 16 page ![]() Data Sheet ADRF5060 ABSOLUTE MAXIMUM RATINGS analog.com Rev. 0 | 5 of 16 Table 2. Absolute Maximum Ratings Parameter Rating Supply Voltage Positive –0.3V to +3.6V Negative –3.6V to +0.3V Digital Control Inputs1 Voltage –0.3V to VDD + 0.3V Current 3mA RF Input Power (f2 = 0.1GHz to 20GHz, TCASE = 85°C3) External Path A or External Path B Selected Average 31dBm Peak4 33.5dBm Through Average 31dBm Peak 33.5dBm Terminated Average 18.5dBm Peak 21.5dBm Hot Switching 31dBm RF Power Under Unbiased Condition (VDD = 0V, VSS = 0V) 24dBm Temperature Junction 135°C Storage –65°C to +150°C Reflow 260°C 1 Overvoltages at the digital control inputs are clamped by internal diodes. Current must be limited to the maximum rating given. 2 For power derating over frequency, see Figure 2. 3 For 105°C operation, the power handling degrades from the TCASE = 85°C specifications by 3dB. 4 Peak has ≤100ns pulse duration and 5% duty cycle. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case bottom (channel to package bottom) thermal resistance. Table 3. Thermal Resistance Package Type θJC1 Unit CC-30-7 Through Path 144 °C/W Terminated Path 800 °C/W 1 θJC was determined by simulation under the following conditions: the heat transfer is due solely to the thermal conduction from the channel through the ground pad to the PCB, and the ground pad is held constant at the operating temperature of 105°C. POWER DERATING CURVE Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C |
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