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ADRF5060BCCZN-R7 Datenblatt(PDF) 5 Page - Analog Devices

Teilenummer ADRF5060BCCZN-R7
Bauteilbeschribung  Nonreflective RF Path Selector SP3T with Bypass, 100MHz to 20GHz
PDF  16 Pages
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Direct Link  http://www.analog.com
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ADRF5060BCCZN-R7 Datenblatt(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5060
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. 0 | 5 of 16
Table 2. Absolute Maximum Ratings
Parameter
Rating
Supply Voltage
Positive
–0.3V to +3.6V
Negative
–3.6V to +0.3V
Digital Control Inputs1
Voltage
–0.3V to VDD + 0.3V
Current
3mA
RF Input Power (f2 = 0.1GHz to 20GHz, TCASE =
85°C3)
External Path A or External Path B Selected
Average
31dBm
Peak4
33.5dBm
Through
Average
31dBm
Peak
33.5dBm
Terminated
Average
18.5dBm
Peak
21.5dBm
Hot Switching
31dBm
RF Power Under Unbiased Condition
(VDD = 0V, VSS = 0V)
24dBm
Temperature
Junction
135°C
Storage
–65°C to +150°C
Reflow
260°C
1 Overvoltages at the digital control inputs are clamped by internal diodes.
Current must be limited to the maximum rating given.
2 For power derating over frequency, see Figure 2.
3 For 105°C operation, the power handling degrades from the TCASE = 85°C
specifications by 3dB.
4 Peak has ≤100ns pulse duration and 5% duty cycle.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
θJC is the junction to case bottom (channel to package bottom)
thermal resistance.
Table 3. Thermal Resistance
Package Type
θJC1
Unit
CC-30-7
Through Path
144
°C/W
Terminated Path
800
°C/W
1 θJC was determined by simulation under the following conditions: the heat
transfer is due solely to the thermal conduction from the channel through the
ground pad to the PCB, and the ground pad is held constant at the operating
temperature of 105°C.
POWER DERATING CURVE
Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C



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