| Datenblatt-Suchmaschine für elektronische Bauteile |
|
ADRF5060BCCZN-R7 Datenblatt(PDF) 12 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADRF5060BCCZN-R7 Datenblatt(HTML) 12 Page - Analog Devices |
|
12 / 16 page ![]() Data Sheet ADRF5060 THEORY OF OPERATION analog.com Rev. 0 | 12 of 16 The ADRF5060 integrates a driver to perform logic functions inter- nally and to provide the user with the advantage of a simplified CMOS-/LVTTL-compatible control interface. The driver features dig- ital control input pins (XC, V1, and V2) that control the state of the external paths. RF INPUT AND OUTPUT All of the RF ports are DC-coupled to 0V, and no DC blocking capacitor is required at the RF ports if the RF line potential is equal to 0V. The RF ports are internally matched to 50Ω; therefore, external matching networks are not required. The insertion loss path conducts the RF signal between the se- lected RF path and the RFIN or RFOUT port. The through path conducts RF signal between the RFIN to RFOUT pins. The isolation path provides high loss between the insertion loss path and the unselected RF port that is terminated to an internal 50Ω resistor. The XC pin is used for the selection cross connections between External Path A or External Path B (see Table 6). The switch design is bidirectional with equal power handling capa- bilities. The RF input signal can be applied to the RFIN or RFOUT ports or the External A or External B paths. Figure 23. External Path A (Left) and External Path B (Right) Configuration Figure 24. Through (Left) and All Off (Right) Configuration Figure 25. XC Configurations OUTB and INA (Left) or OUTA and INB (Right) Table 6. Control Voltage Truth Table RF Path Selection XC V1 V2 Through Don't care Low Low External Path B Low Low High External Path A Low High Low All Off (Isolation) Don't care High High Through Don't care Low Low Out A and In B High Low High Out B and In A High High Low All Off (Isolation) Don't care High High POWER SUPPLY The ADRF5060 requires a positive supply voltage applied to the VDD pin and a negative supply voltage applied to the VSS pin. Bypassing capacitors are recommended on the supply lines to minimize RF coupling. The ideal power-up sequence is as follows: 1. Connect GND. 2. Power up VDD and VSS voltages. Power up VSS after VDD to avoid current transients on VDD during ramp up. 3. Apply the digital control input (XC, V1, and V2). The relative order of the control inputs is not important. However, applying the digital control input pins before the VDD supply can inadver- tently forward bias and damage the internal ESD protection structures. A series 1kΩ resistor can be used to limit the current flowing into the digital control input pins in such cases. If the digital control input pins are not driven to a valid logic state (that is, the controller output is in a high impedance state) after VDD is powered up, it is recommended to use pull-up and power-down resistors. 4. Apply an RF input signal. The ideal power-down sequence is the reverse order of the power- up sequence. |
|
|
Link URL |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Link zum Datenblatt | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |