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ADRF5060BCCZN-R7 Datenblatt(PDF) 14 Page - Analog Devices

Teilenummer ADRF5060BCCZN-R7
Bauteilbeschribung  Nonreflective RF Path Selector SP3T with Bypass, 100MHz to 20GHz
PDF  16 Pages
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ADRF5060BCCZN-R7 Datenblatt(HTML) 14 Page - Analog Devices

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Data Sheet
ADRF5060
APPLICATIONS INFORMATION
analog.com
Rev. 0 | 14 of 16
Transfer Switch
In the configuration shown in Figure 29, two ADRF5060 devices
are positioned to create a transfer switch circuit. This circuit allows
users to switch between configurations as shown in the signal path
(see Figure 30) when the digital control pin is toggled between high
and low (see Table 8).
Figure 29. Transfer Switch Application Block Diagram
Figure 30. Transfer Switch Signal Path
Table 8. Transfer Switch Application Truth Table
CTRL1
Switch State2
Low
Through paths selected: RF4 to RF2 and RF1 to RF3
High
Adjacent (ADJ) paths selected: RF4 to RF1 and RF2 to RF3
1 CTRL refers to the digital control pin (V2).
2 RF1, RF2, RF3, and RF4 are defined in Figure 29 .
RECOMMENDATIONS FOR PCB DESIGN
The RF ports are matched to 50Ω internally, and the pinout is
designed to mate a coplanar waveguide (CPWG) with 50Ω charac-
teristic impedance on the PCB. Figure 31 shows the referenced
CPWG RF trace design for an RF substrate with 8mil thick Rogers
RO4003 dielectric material. RF trace with 14mil width and 7mil
clearance is recommended for 1.5mil finished copper thickness.
Figure 31. Example PCB Stack-Up
Figure 32 shows the routing of the RF traces, supply, and control
signals from the ADRF5060. The ground planes are connected with
as many filled, through vias as allowed for optimal RF and thermal
performance. The primary thermal path for the ADRF5060 is the
bottom side.
Figure 32. PCB Routings
Figure 33 shows the recommended layout from the device RF pins
(RFIN, RFOUT, OUTA, OUTB, INA, and INB) to the 50Ω CPWG
on the referenced stack-up. The PCB pads are drawn 1:1 to the
device pads. The ground pads are drawn solder mask defined, and
the signal pads are drawn as pad defined. The RF trace from the
PCB pad is extended with the same width till the package edge
and tapered to the RF trace with a 45° angle. The paste mask is
also designed to match the pad without any aperture reduction. The
paste is divided into multiple openings for the paddle.



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