ADS5500IPAPR datasheet(28/37 Pages) TI2

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PowerPAD PACKAGE

Assembly Process

ADS5500

SBAS303F – DECEMBER 2003 – REVISED FEBRUARY 2007

Write D000h (Address D, Data 000)

Data section. The recommended thermal pad

Write E000h (Address E, Data 804)

dimension is 8 mm x 8 mm.

Write 0000h (Address 0, Data 000)

2. Place a 5-by-5 array of thermal vias in the

Write 1000h (Address 1, Data 000)

thermal pad area. These holes should be 13

Write F000h (Address F, Data 000).

mils in diameter. The small size prevents

wicking of the solder through the holes.

NOTE: This procedure is only required if a RESET

pulse is not provided to the device.

3. It is recommended to place a small number of

25 mil diameter holes under the package, but

outside the thermal pad area to provide an

additional heat path.

The PowerPAD package is a thermally enhanced

4. Connect all holes (both those inside and

standard size IC package designed to eliminate the

outside the thermal pad area) to an internal

use of bulky heat sinks and slugs traditionally used in

copper plane (such as a ground plane).

thermal packages. This package can be easily

5. Do not use the typical web or spoke via

mounted using standard printed circuit board (PCB)

connection

pattern

when

connecting

the

assembly techniques and can be removed and

thermal vias to the ground plane. The spoke

replaced using standard repair procedures. AVDD.

pattern increases the thermal resistance to the

The programming is done through a three-wire

ground plane.

interface. The timing diagram and serial register

setting in the Serial Programing Interface section

6. The

top-side

solder

mask

should

leave

describe the programming of this register.

exposed the terminals of the package and the

thermal pad area.

The PowerPAD package is designed so that the lead

7. Cover the entire bottom side of the PowerPAD

frame die pad (or thermal pad) is exposed on the

vias to prevent solder wicking.

bottom of the IC. This provides a low thermal

resistance path between the die and the exterior of

8. Apply solder paste to the exposed thermal

the package. The thermal pad on the bottom of the

pad area and all of the package terminals.

IC can then be soldered directly to the printed circuit

For

detailed

information

regarding

the

board

(PCB),

using

the

PCB

heatsink.

PowerPAD package and its thermal properties, see

Programming is done through a three-wire interface.

either the SLMA004B application brief PowerPAD

The timing diagram and serial register setting in the

Made Easy or SLMA002 technical brief PowerPAD

Serial Programing Interface section describe the

Thermally Enhanced Package.

programming of this register.

1. Prepare

the

PCB

top-side

etch

pattern

including etch for the leads as well as the

thermal pad as illustrated in the Mechanical

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