ST7SCR_07 datasheet(78/101 Pages) STMICROELECTRONICS

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ST7SCR

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14 ELECTRICAL CHARACTERISTICS

14.1 ABSOLUTE MAXIMUM RATINGS

This product contains devices for protecting the in-

puts against damage due to high static voltages,

however it is advisable to take normal precautions

to avoid appying any voltage higher than the spec-

ified maximum rated voltages.

For proper operation it is recommended that VI

and VO be higher than VSS and lower than VDD.

Reliability is enhanced if unused inputs are con-

nected to an appropriate logic voltage level (VDD

or VSS).

Power Considerations. The average chip-junc-

tion temperature, TJ, in Celsius can be obtained

from:

TJ =

TA + PD x RthJA

Where:

TA =

Ambient Temperature.

RthJA =Package thermal resistance

(junction-to ambient).

PD =

PINT + PPORT.

PINT =IDD x VDD (chip internal power).

PPORT =Port power dissipation

determined by the user)

Stresses above those listed as “absolute maxi-

mum ratings” may cause permanent damage to

the device. This is a stress rating only and func-

tional operation of the device at these conditions is

not implied. Exposure to maximum rating for ex-

tended periods may affect device reliability.

General Warning: Direct connection to VDD or VSS of the I/O pins could damage the device in case of program counter

corruption (due to unwanted change of the I/O configuration). To guarantee safe conditions, this connection has to be

done through a typical 10K

Ω pull-up or pull-down resistor.

Thermal Characteristics

Symbol

Ratings

Value

Unit

VDD - VSS

Supply voltage

6.0

VIN

Input voltage

VSS - 0.3 to VDD + 0.3

VOUT

Output voltage

VSS - 0.3 to VDD + 0.3

ESD

ESD susceptibility

2000

ESDCard

ESD susceptibility for card pads

4000

IVDD_i

Total current into VDD_i (source)

250

IVSS_i

Total current out of VSS_i (sink)

250

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance

LQFP64

SO24

QFN24

°C/W

TJmax

Max. junction temperature

150

°C

TSTG

Storage temperature range

-65 to +150

°C

PDmax

Power dissipation

QFN24

SO24

600

500

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