CC1404P datasheet(41/44 Pages) TI2

41 / 44 page

9.5 Trademarks

SimpleLink™, BoosterPack™, SmartRF™, and Code Composer Studio™ are trademarks of Texas Instruments.

I-jet™ is a trademark of IAR Systems AB.

J-Link™ is a trademark of SEGGER Microcontroller Systeme GmbH.

Wi-SUN® is a registered trademark of Wi-SUN Alliance.

Eclipse® is a registered trademark of Eclipse Foundation.

IAR Embedded Workbench® is a registered trademark of IAR Systems AB.

Windows® is a registered trademark of Microsoft Corporation.

All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as

defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled

product restricted by other applicable national regulations, received from disclosing party under nondisclosure

obligations (if any), or any direct product of such technology, to any destination to which such export or re-export

is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S.

Department of Commerce and other competent Government authorities to the extent required by those laws.

9.8 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

DATE

REVISION

NOTES

September 2026

Initial Release

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

11.1 Packaging Information

www.ti.com

CC1404P

SWRS300 – SEPTEMBER 2026

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CC1404P Datenblatt(PDF) 41 Page - Texas Instruments