6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1) (2)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VDDS(3)

Supply voltage

–0.3

3.9

V

Input voltage

Voltage on any digital pin(4)

–0.3

VDDS + 0.3, max 3.9

V

Input RF level

Input level, RF pins (RF_N, RF_P)

10

dBm

Input RF level

Input level, ULNA pins

0

dBm

Tstg

Storage temperature

–40

125

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and

this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

All voltage values are with respect to ground, unless otherwise noted.

(3)

VDDS_DCDC must be at the same potential as VDDS.

(4)

Including analog capable DIOs.

6.2 ESD Ratings

PARAMET

ER

PARAMETER

TEST CONDITIONS

VALUE

UNIT

VESD

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

All pins,

except ULNA_OUT

±2000

V

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

ULNA_OUT

±1500

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

All pins

±500

V

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

Operating ambient temperature(1)

Operating ambient temperature(1)

-40

105

°C

Operating supply voltage (VDDS)

1.71

3.8

V

Rising supply voltage slew rate

0

100

mV/µs

Falling supply voltage slew rate(2)

0

1

mV/µs

(1)

Operation at or near maximum operating temperature for extended durations will result in a reduction in lifetime.

(2)

For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 10µF VDDS input capacitor must be used

to ensure compliance with this slew rate.

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CC1404P

SWRS300 – SEPTEMBER 2026

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