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ADP5310AREZN-R7 Datenblatt(PDF) 8 Page - Analog Devices

Teilenummer ADP5310AREZN-R7
Bauteilbeschribung  3-Channel, Integrated Ultralow Power Solution with Dual Buck Regulators and Load Switch
PDF  28 Pages
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Direct Link  http://www.analog.com
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ADP5310AREZN-R7 Datenblatt(HTML) 8 Page - Analog Devices

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ADP5310
Data Sheet
Rev. A | Page 8 of 28
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
PVIN2
NC
SW2
VOUT3
FB2
PGND2
PVIN1
PGND1
EN1
FB1
VREG
EN3
AGND
SYNC/MODE
PWRGD
SW1
ADP5310
TOP VIEW
(Not to Scale)
NOTES
1. NC = NO CONNECT.
2. SOLDER THE EXPOSED PAD TO A LARGE EXTERNAL
COPPER GROUND PLANE UNDERNEATH THE IC FOR
THERMAL DISSIPATION.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
PVIN1
Power Input of Channel 1. This pin must be connected to PVIN2.
2
PVIN2
Power Input of Channel 2 and Internal Linear Regulator.
3
NC
No Connect. This pin is not internally connected. Leave this pin floating.
4
SW2
Switching Node Output of Channel 2.
5
PGND2
Power Ground of Channel 2.
6
FB2
Feedback Sensing Input of Channel 2.
7
VOUT3
Power Output of Channel 3.
8
EN3
Enable Input of Channel 3.
9
AGND
Analog Ground.
10
VREG
Output of the Internal Linear Regulator. Connect a 1.0 µF ceramic capacitor between this pin and ground.
11
SYNC/MODE
Synchronization Input Pin (SYNC). To synchronize the switching frequency of the device to an external clock,
connect this pin to an external clock with a frequency from 400 kHz to 1.4 MHz.
PWM or Hysteresis Mode Selection Pin of Channel 2 (MODE). When this pin is logic high, the regulator operates
in PWM mode. When this pin is logic low, the regulator operates in hysteresis mode.
12
PWRGD
Power-Good Signal Output. This open-drain output is the power-good signal of Channel 1.
13
FB1
Feedback Sensing Input of Channel 1.
14
EN1
Enable Input of Channel 1.
15
PGND1
Power Ground of Channel 1.
16
SW1
Switching Node Output of Channel 1.
EPAD
Exposed Pad. Solder the exposed pad to a large external copper ground plane underneath the IC for thermal
dissipation.



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