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ADP5310AREZN-R7 Datenblatt(PDF) 8 Page - Analog Devices |
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ADP5310AREZN-R7 Datenblatt(HTML) 8 Page - Analog Devices |
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8 / 28 page ![]() ADP5310 Data Sheet Rev. A | Page 8 of 28 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 PVIN2 NC SW2 VOUT3 FB2 PGND2 PVIN1 PGND1 EN1 FB1 VREG EN3 AGND SYNC/MODE PWRGD SW1 ADP5310 TOP VIEW (Not to Scale) NOTES 1. NC = NO CONNECT. 2. SOLDER THE EXPOSED PAD TO A LARGE EXTERNAL COPPER GROUND PLANE UNDERNEATH THE IC FOR THERMAL DISSIPATION. Figure 3. Pin Configuration Table 5. Pin Function Descriptions Pin No. Mnemonic Description 1 PVIN1 Power Input of Channel 1. This pin must be connected to PVIN2. 2 PVIN2 Power Input of Channel 2 and Internal Linear Regulator. 3 NC No Connect. This pin is not internally connected. Leave this pin floating. 4 SW2 Switching Node Output of Channel 2. 5 PGND2 Power Ground of Channel 2. 6 FB2 Feedback Sensing Input of Channel 2. 7 VOUT3 Power Output of Channel 3. 8 EN3 Enable Input of Channel 3. 9 AGND Analog Ground. 10 VREG Output of the Internal Linear Regulator. Connect a 1.0 µF ceramic capacitor between this pin and ground. 11 SYNC/MODE Synchronization Input Pin (SYNC). To synchronize the switching frequency of the device to an external clock, connect this pin to an external clock with a frequency from 400 kHz to 1.4 MHz. PWM or Hysteresis Mode Selection Pin of Channel 2 (MODE). When this pin is logic high, the regulator operates in PWM mode. When this pin is logic low, the regulator operates in hysteresis mode. 12 PWRGD Power-Good Signal Output. This open-drain output is the power-good signal of Channel 1. 13 FB1 Feedback Sensing Input of Channel 1. 14 EN1 Enable Input of Channel 1. 15 PGND1 Power Ground of Channel 1. 16 SW1 Switching Node Output of Channel 1. EPAD Exposed Pad. Solder the exposed pad to a large external copper ground plane underneath the IC for thermal dissipation. |
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