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M24256X-F Datenblatt(PDF) 33 Page - STMicroelectronics |
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M24256X-F Datenblatt(HTML) 33 Page - STMicroelectronics |
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33 / 42 page ![]() 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10.1 WLCSP4 (CU) package information WLCSP4 is a 4 bumps, 0.703 x 0.977 mm, 0.4 x 0.5 mm pitch thin wafer level chip scale package. Figure 19. WLCSP4 (CU) - Outline Orientation reference E D Orientation reference F DETAIL A G e e1 BUMP SIDE SIDE VIEW TOP VIEW A2 A3 A A1 BACKSIDE PROTECTION b SEATING PLANE ccc Y ddd Z Z X b M M eee Z A1 aaa (2X) bbb // Z aaa (2X) X Y Z DETAIL A ROTATED 90 1. Drawing is not to scale M24256X-F Package information DS12380 - Rev 2 page 33/42 |
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