SX28ACSLASHDP datasheet(49/51 Pages) PARALLAX

49 / 51 page

Parallax SX20AC/SX28AC

www.parallax.com

Page 49 of 51

Rev 1.6 11/20/2006

19.0 MANUFACTURING INFORMATION

19.1.

Reflow Peak Temperature

Package Type

Reflow Peak Temp.

Leaded

235+5/-0 °C

Green/RoHS

255+5/-0 °C

19.2.

MSL3 Compliance

Chips shipped in production quantities are MSL3

compliant.

For chips shipped in sample quantities or

stored in compromised packaging,

you may want to

remove excess moisture before assembly by baking at

93 °C for 12 hours immediately before commencing

soldering production.

19.3.

Green/RoHS Compliance

All SX part numbers ending in “-G” are certified

Green/RoHS Compliant. The Certificates of Compliance

are appended to this datasheet; full test reports for each

model can be obtained by contacting the Parallax Sales

Team.

19.4.

Stress Testing Data Summary

The Parallax SX chip is packaged by a different supplier

than previously used for the Ubicom SX. For this reason

Parallax engaged in a series of stress tests useful for a

change of packaging suppliers. Parallax SX chips

packaged at Greatek in Taiwan were exposed to these

stresses between June and September 2006. The stresses

were provided by a separate stress testing reliability

qualification services firm (Nano Measurements in Santa

Clara, California).

The stress tests chosen are common for a change of

packaging suppliers. The stress testing firm conducted the

tests in accordance with the applicable Joint Electron

Device

Engineering

Council

(www.jedec.com)

guidelines.

The following stresses were chosen:

• Preconditioning, Level 3, 192 hours 30° C, 60% RH,

preflow peak leaded and unleaded (depending on the

package)

• JESD22-A118, unbiased HAST 192 hours,

110°-130° C, 85% RH, 10-20 PSIG

• JESD22-A102, autoclave, 121° C, 100% RH, 15

PSIG, non-biased, 96 hours

RoHS-compliant and standard chips were exposed to the

stresses separately to further identify if failures would be

associated with a particular package type. Between each

stress, the parts were sent back to Parallax for our

standard production test which exercises the I/O, RAM

and EE/Flash memory, operating voltage and current

draw.

The results are that 100% of the chips passed the Parallax

standard production test, in between and after the stresses

were applied to the chips.

Stock Code

Tested

Passed

SX20AC/SS-G

SX28AC/SS-G

SX28AC/DP-G

SX48BD-G

Subtotal

SX20AC/SS-G

SX28AC/SS-G

SX28AC/DP-G

SX48BD-G

Subtotal

Other stress test data are available upon request from the

Parallax

Research

and

Development

team,

contact

Parallax Sales or Tech Support.

Parallax Sales and Tech Support Contact Information

For the latest information on SX programming tools, development boards, compilers, instructional materials, and application

examples, please visit www.parallax.com/sx.

Parallax, Inc.

599 Menlo Drive, Suite 100

Rocklin, CA 95765

Sales/Tech Support: (916) 624-8333

Toll Free in the US: 1-888-512-1024

Sales: sales@parallax.com

Tech Support: support@parallax.com

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