SX28ACSLASHDP datasheet(2/51 Pages) PARALLAX

2 / 51 page

Parallax SX20AC/SX28AC

www.parallax.com

Page 2 of 51

Rev 1.6 11/20/2006

Table of Contents

1.0

Product Overview......................................................... 1

1.1.

Introduction ................................................................................1

1.2.

Key Features..............................................................................3

1.3.

Architecture................................................................................4

1.4.

Programming Benefits in Assembly and High-Level Languages 4

1.4.1.

Parallax SX/B Basic Compiler ...............................................................4

1.5.

Programming and Debugging Support .......................................4

1.6.

Applications................................................................................4

1.7.

Support ......................................................................................4

1.8.

Part Numbering..........................................................................5

2.0

Connection Diagrams .................................................. 6

2.1.

Pin Assignments ........................................................................6

2.2.

Pin Descriptions .........................................................................6

2.3.

Typical Connection Diagrams ....................................................7

3.0

Port Descriptions ......................................................... 9

3.1.

Reading and Writing the Ports ...................................................9

3.1.1.

Read-Modify-Write Considerations......................................................11

3.2.

Port Configuration ....................................................................11

3.2.1.

MODE Register ...................................................................................11

3.2.2.

Port Configuration Registers ...............................................................11

3.2.3.

Port Configuration Upon Reset............................................................12

4.0

Special-Function Registers....................................... 13

4.1.

PC Register (02h) ....................................................................13

4.2.

STATUS Register (03h) ...........................................................13

4.3.

OPTION Register.....................................................................14

5.0

Device Configuration Registers................................ 15

5.1.

FUSE Word (Read/Program at FFFh in Main Memory Map) ....15

5.2.

FUSEX Word (Read/Program via Programming Command) ....16

5.3.

DEVICE Word (Hard-Wired Read-Only)...................................16

6.0

Memory Organization ................................................ 17

6.1.

Program Memory .....................................................................17

6.1.1.

Program Counter.................................................................................17

6.1.2.

Subroutine Stack .................................................................................17

6.2.

Data Memory ...........................................................................17

6.2.1.

File Select Register (04h)....................................................................17

7.0

Power Down Mode ..................................................... 19

7.1.

Multi-Input Wakeup ..................................................................19

7.2.

Port B MIWU/Interrupt Configuration........................................20

8.0

Interrupt Support........................................................ 21

9.0

Oscillator Circuits ...................................................... 23

9.1.

XT, LP or HS modes ................................................................23

9.2.

75 MHz Operation....................................................................25

9.3.

External RC Mode....................................................................25

9.4.

Internal RC Mode.....................................................................25

10.0

Real Time Clock (RTCC)/Watchdog Timer............... 26

10.1.

RTCC.......................................................................................26

10.2.

Watchdog Timer ...................................................................... 26

10.3.

The Prescaler .......................................................................... 26

11.0

Comparator .................................................................27

12.0

Reset............................................................................28

13.0

Brown-Out Detector ...................................................29

14.0

15.0

Instruction Set ............................................................31

15.1.

Instruction Set Features........................................................... 31

15.2.

Instruction Execution ............................................................... 31

15.3.

Addressing Modes ................................................................... 31

15.4.

RAM Addressing...................................................................... 32

15.5.

The Bank Instruction................................................................ 32

15.6.

Bit Manipulation ....................................................................... 32

15.7.

Input/Output Operation ............................................................ 32

15.8.

Increment/Decrement .............................................................. 32

15.9.

Loop Counting and Data Pointing Testing................................ 32

15.10.

Branch and Loop Call Instructions ........................................... 32

15.10.1.

Jump Operation .................................................................................. 33

15.10.2.

Page Jump Operation......................................................................... 33

15.10.3.

Call Operation..................................................................................... 33

15.10.4.

Page Call Operation ........................................................................... 33

15.11.

Return Instructions................................................................... 33

15.12.

Subroutine Operation............................................................... 33

15.12.1.

Push Operation................................................................................... 33

15.12.2.

Pop Operation .................................................................................... 34

15.13.

Comparison and Conditional Branch Instructions .................... 34

15.14.

Logical Instruction.................................................................... 34

15.15.

Shift and Rotate Instructions.................................................... 34

15.16.

Complement and SWAP.......................................................... 34

16.0

Native SX Instruction Set Summary Tables .............35

16.1.

Equivalent Assembler Mnemonics ........................................... 39

17.0

Electrical Characteristics...........................................40

17.1.

Absolute Maximum Ratings ..................................................... 40

17.2.

DC Characteristics................................................................... 41

17.3.

AC Characteristics ................................................................... 42

17.4.

Comparator DC and AC Specifications.................................... 42

17.5.

Typical Performance Characteristics (25°C) ............................ 43

18.0

Package Dimensions..................................................46

18.1.

SX20AC/SS ............................................................................. 46

18.2.

SX28AC/SS ............................................................................. 47

18.3.

SX28AC/DP............................................................................. 48

19.0

Manufacturing Information ........................................49

19.1.

Reflow Peak Temperature ....................................................... 49

19.2.

MSL3 Compliance ................................................................... 49

19.3.

Green/RoHS Compliance ........................................................ 49

19.4.

Stress Testing Data Summary ................................................. 49

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