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AT25QL641 Datenblatt(PDF) 72 Page - Dialog Semiconductor |
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AT25QL641 Datenblatt(HTML) 72 Page - Dialog Semiconductor |
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72 / 77 page ![]() 71 AT25QL641 DS-25QL641–130E–10/2018 9. Ordering Information 9.1 Ordering Code Detail A T 2 5 Q 6 4 S E U T 1 – – L Designator Product Family Device Density 641 = 64-megabit Package Option M = 8-pad, 5 x 6 x 0.6 mm UDFN S = 8-lead, 0.208" wide SOIC U = 8-ball 0.5mm pitch dBGA DWF = Die in Wafer Form Device Grade U = Green, Matte Sn or Sn alloy, Industrial temperature range (–40°C to +85°C) H = NiPdAu lead-frame Industrial Temp range (-40C+85C) Shipping Carrier Option T = Tape and reel Operating Voltage E = 1.7V to 2.0V Ordering Code (1) (2) Package Lead Finish Operating Voltage Max. Freq. (MHz) Operation Range AT25QL641-MHE-T 8MA1 NiPdAu 1.7V - 2.0V 133 MHz -40 oC to 85 oC (Industrial Temperature Range) AT25QL641-SUE-T 8S4 SnAgCu AT25QL641-UUE-T 8-WLCSP 1. The AT25QL641 is shipped with the QE bit set to 1 enabling the Quad / QPI mode. 2. The shipping carrier option code is not marked on the devices. Package Type 8S4 8-lead, 0.208" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC) 8MA1 8-pad (5 x 6 x 0.6 mm body), Thermally Enhanced Plastic Ultra-Thin Dual Flat No-lead (UDFN) 8-WLCSP 8-ball, 0.5mm pitch, die Ball Grid Array (dBGA) |
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