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OPA607 Datenblatt(PDF) 34 Page - Texas Instruments |
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OPA607 Datenblatt(HTML) 34 Page - Texas Instruments |
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34 / 52 page ![]() 8.3 Power Supply Recommendations The OPA810 is intended for operation on supplies ranging from 4.75 V to 27 V. The OPA810 can be operated on single-sided supplies, split and balanced bipolar supplies, or unbalanced bipolar supplies. Operating from a single supply can have numerous advantages. With the negative supply at ground, the DC errors resulting from the –PSRR term can be minimized. Typically, AC performance improves slightly at 10-V operation with minimal increase in supply current. Minimize the distance (< 0.1 in) from the power-supply pins to high-frequency, 0.01-µF decoupling capacitors. A larger capacitor (2.2 µF typical) is used along with a high-frequency, 0.01-µF, supply-decoupling capacitor at the device supply pins. For single-supply operation, only the positive supply has these capacitors. When a split supply is used, use these capacitors from each supply to ground. If necessary, place the larger capacitors further from the device and share these capacitors among several devices in the same area of the printed circuit board (PCB). An optional supply decoupling capacitor across the two power supplies (for split-supply operation) reduces second harmonic distortion. 8.4 Layout 8.4.1 Layout Guidelines Achieving optimized performance with a high-frequency amplifier such as the OPA810 requires careful attention to board layout parasitics and external component types. The OPA2810EVM can be used as a reference when designing the circuit board. Recommendations that optimize performance include: 1. Minimize parasitic capacitance to any ac ground for all signal I/O pins. Parasitic capacitance on the output and inverting input pins can cause instability—on the noninverting input, this capacitance can react with the source impedance to cause unintentional band-limiting. To reduce unwanted capacitance, open a window around the signal I/O pins in all ground and power planes around those pins. Otherwise, ground and power planes must be unbroken elsewhere on the board. 2. Minimize the distance (< 0.1 in) from the power-supply pins to high-frequency, 0.01-µF decoupling capacitors. At the device pins, do not allow the ground and power plane layout to be in close proximity to the signal I/O pins. Avoid narrow power and ground traces to minimize inductance between the pins and the decoupling capacitors. Always decouple the power-supply connections with these capacitors. Use larger (2.2-µF to 6.8-µF) decoupling capacitors, effective at lower frequency, on the supply pins. Place these capacitors somewhat farther from the device and share these capacitors among several devices in the same area of the PCB. 3. Careful selection and placement of external components preserve the high-frequency performance of the OPA810. Resistors must be a low reactance type. Surface-mount resistors work best and allow a tighter overall layout. Metal film and carbon composition axially leaded resistors can also provide good high-frequency performance. Again, keep the leads and PCB trace length as short as possible. Never use wirewound type resistors in a high-frequency application. Because the output pin and inverting input pin are the most sensitive to parasitic capacitance, always position the feedback and series output resistor, if any, as close as possible to the output pin. Other network components, such as noninverting input termination resistors, must also be placed close to the package. Even with a low parasitic capacitance shunting the external resistors, excessively high resistor values can create significant time constants that can degrade performance. Good axial metal film or surface-mount resistors have approximately 0.2 pF in shunt with the resistor. For resistor values greater than 10 kΩ, this parasitic capacitance can add a pole or zero close to the GBWP of 70 MHz and subsequently affects circuit operation. Keep resistor values as low as possible and consistent with load driving considerations. Lowering the resistor values keeps the resistor noise terms low, and minimizes the effect of parasitic capacitance, however lower resistor values increase the dynamic power consumption because RF and RG become part of the amplifiers output load network. Transimpedance applications (see the Section 8.2.1 section) can use whatever feedback resistor is required by the application as long as the feedback compensation capacitor is set considering all parasitic capacitance terms on the inverting node. OPA810 SBOS799E – AUGUST 2019 – REVISED AUGUST 2024 www.ti.com 34 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: OPA810 |
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