ADP1876ACPZ-R7 datasheet(7/24 Pages) AD

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Data Sheet

ADP1876

Rev. A | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN1/EN2, RAMP1/RAMP2

21 V

FB1/FB2, COMP1/COMP2, SS1/SS2, TRK1,

VINLDO, VOUTLDO, VCCO, VDL,

PGOOD1/PGOOD2

−0.3 V to +6 V

ILIM1/ILIM2

−0.3 V to +21 V

BST1/BST2 to SW1/SW2

−0.3 V to +6 V

BST1/BST2, DH1/DH2, SW1/SW2 to

PGND1/PGND2

−0.3 V to +28 V

DL1/DL2 to PGND1/PGND2

−0.3 V to VCCO + 0.3 V

BST1/BST2 to PGND1/PGND2, SW1/SW2 to

PGND1/PGND2 (20 ns Transients)

32 V

SW1, SW2 to PGND1, PGND2

(20 ns Transients)

25 V

DL1/DL2, SW1/SW2, ILIM1/ILIM2 to

PGND1/PGND2 (20 ns Negative Transients)

−8 V

PGND1/PGND2 to AGND

−0.3 V to +0.3 V

PGND1/PGND2 to AGND (20 ns Transients)

−8 V to +4 V

θJA, Multilayer PCB (Natural Convection)1,2

32.6°C/W

Operating Junction Temperature Range3

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Maximum Soldering Lead Temperature

260°C

1 Measured with exposed pad attached to the printed circuit board (PCB).

2 Junction-to-ambient thermal resistance (θ

JA) of the package was calculated

or simulated on a multilayer PCB.

3 The junction temperature, T

J, of the device is dependent on the ambient

temperature, TA, the power dissipation of the device, PD, and the junction to

ambient thermal resistance of the package, θJA. Maximum junction

temperature is calculated from the ambient temperature and power

dissipation using the formula, TJ = TA + PD × θJA.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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