T25S16AFEPR datasheet(3/74 Pages) HMSEMI

3 / 74 page

7.1.2 Write Enable (06h)................................................................................................................ 39

7.1.3 Write Enable for Volatile Status Register (50h)................................................................40

7.1.4 Write Disable (04h)................................................................................................................40

7.1.5 Write Status Register (01h/31h/11h)..................................................................................40

7.2 Program and Erase Commands.....................................................................................................41

7.2.1 Page Program (PP) (02h).................................................................................................... 42

7.2.2 Quad Input Page Program (32h)........................................................................................ 42

7.2.3 Sector Erase (SE) (20h).......................................................................................................43

7.2.4 Block Erase (BE) (D8h) and Half Block Erase (52h).......................................................44

7.2.5 Chip Erase (CE) (C7h or 60h).............................................................................................44

7.2.6 Erase / Program Suspend (75h).........................................................................................45

7.2.7 Erase / Program Resume (7Ah)......................................................................................... 46

7.3 Read Commands..............................................................................................................................46

7.3.1 Read Data (03h).................................................................................................................... 46

7.3.2 Fast Read (0Bh).................................................................................................................... 47

7.3.3 Fast Read Dual Output (3Bh)..............................................................................................48

7.3.4 Fast Read Quad Output (6Bh)............................................................................................ 48

7.3.5 Fast Read Dual I/O (BBh)....................................................................................................49

7.3.6 Fast Read Quad I/O (EBh).................................................................................................. 49

7.3.7 Word Read Quad I/O (E7h)................................................................................................. 51

7.3.8 Octal Word Read Quad I/O (E3h).......................................................................................52

7.3.9 Set Burst with Wrap (77h)....................................................................................................53

7.4 Reset Commands............................................................................................................................. 54

7.4.1 Software Reset Enable (66h).............................................................................................. 54

7.4.2 Software Reset (99h)............................................................................................................55

7.5 ID and Security Commands............................................................................................................55

7.5.1 Deep Power-down (DP) (B9h)............................................................................................ 55

7.5.2 Release Power-down / Device ID (ABh)........................................................................... 55

7.5.3 Read Manufacturer / Device ID (90h)................................................................................56

7.5.4 Read Identification (RDID) (9Fh)........................................................................................ 57

7.5.5 Read SFDP Register (5Ah)................................................................................................. 57

7.5.6 Erase Security Registers (44h)...........................................................................................58

7.5.7 Program Security Registers (42h)......................................................................................58

7.5.8 Read Security Registers (48h)............................................................................................59

7.5.9 Individual Block/Sector Lock (36h).....................................................................................59

7.5.10 Individual Block/Sector Unlock (39h)...............................................................................60

7.5.11 Read Block/Sector Lock (3Dh)..........................................................................................61

7.5.12 Global Block/Sector Lock (7Eh)........................................................................................61

7.5.13 Global Block/Sector Unlock (98h).................................................................................... 62

7.5.14 Read Manufacturer / Device ID Dual I/O (92h)..............................................................62

7.5.15 Read Manufacturer / Device ID Quad I/O (94h)............................................................ 63

7.5.16 Read Unique ID Number (4Bh).........................................................................................63

7.5.17 Set Read Parameters (C0h)..............................................................................................63

7.5.18 Burst Read with Wrap (0Ch)............................................................................................. 64

7.5.19 Enter QPI Mode (38h)........................................................................................................ 65

7.5.20 Exit QPI Mode (FFh)...........................................................................................................65

8. ELECTRICAL CHARACTERISTIC.......................................................................................................... 66

8.1. Absolute Maximum Ratings........................................................................................................... 67

8.2. Recommended Operating Ranges...............................................................................................67

8.3. DC Characteristics...........................................................................................................................68

8.4. AC Measurement Conditions.........................................................................................................68

8.5. AC Electrical Characteristics..........................................................................................................69

9. PACKAGE MECHANICAL.........................................................................................................................71

9.1. 8-Pin SOIC 150-mil..........................................................................................................................71

9.2. 8-Pin SOIC 208-mil..........................................................................................................................71

9.3. 8-Contact WSON (6x5mm)............................................................................................................72

9.4. 8-Pin PDIP 300-mil..........................................................................................................................72

HM25Q128A

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