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STM32U595AI Datenblatt(PDF) 360 Page - STMicroelectronics

Teilenummer STM32U595AI
Bauteilbeschribung  Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU,240 DMIPS, up to 4 MB Flash, 2.5 MB SRAM, LTDC, MIPI® DSI
PDF  377 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32U595AI Datenblatt(HTML) 360 Page - STMicroelectronics

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Package information
STM32U59xxx
360/377
DS13633 Rev 1
6.5
WLCSP150 package information
This WLCSP is a 150-ball, 5.38 x 5.47 mm, 0.4 mm pitch, wafer level chip scale array
package.
Figure 97. WLCSP150 - Outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of
the pattern of balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc
perpendicular to datum Z and located on true position with respect to datums X and Y as defined by e. The
axis perpendicular to datum Z of each ball must lie within this tolerance zone.
A1 BALL LOCATION
F
G
e1
e
e
e1 E
BOTTOM VIEW
A3
A2
FRONT VIEW
b
X
E
A1 ORIENTATION
REFERENCE
aaa
D
A2
A
DETAIL A
A1
bbb Z
SIDE VIEW
A1
b (150)
Z
eee
ccc
ddd
ZX Y
Z
DETAIL A
ROTATED 90
Z
BUMP
B0DX_WLCSP150_ME_V1



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