STM32U595AI datasheet(364/377 Pages) STMICROELECTRONICS

364 / 377 page

Package information

STM32U59xxx

364/377

DS13633 Rev 1

Figure 100. TFBGA169 - Footprint example

eee(4)

0.09

0.0035

fff(5)

0.05

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. - Thin profile: 1.00mm < A ≤ 1.20mm / Fine pitch: e < 1.00 mm pitch.

- The total profile height (Dim A) is measured from the seating plane to the top of the component

- The maximum total package height is calculated by the following methodology:

A Max = A1 Typ + A2 Typ + A4 Typ +√ (A1² + A2² + A4² tolerance values)

3. The typical ball diameter before mounting is 0.25 mm.

4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true

position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball

must lie within this tolerance zone.

5. The tolerance of position that controls the location of the balls within the matrix with respect to each other.

For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position

as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each

tolerance zone fff in the array is contained entirely in the respective zone eee above The axis of each ball

must lie simultaneously in both tolerance zones.

Table 161. TFBGA169 - Mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

BGA_WLCSP_FT_V1

Dsm

Dpad

STM32U595AI Datenblatt(PDF) 364 Page - STMicroelectronics