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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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PIC16F570 Datenblatt(PDF) 126 Page - Microchip Technology |
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PIC16F570 Datenblatt(HTML) 126 Page - Microchip Technology |
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126 / 134 page  PIC16F527 DS40001652C-page 126 2012-2014 Microchip Technology Inc. RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 2.80 2.80 MILLIMETERS 0.50 BSC MIN E MAX 4.00 Contact Pad Length (X20) Contact Pad Width (X20) Y1 X1 0.80 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2255A NOM 20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN] SILK SCREEN 1 2 20 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 4.00 Contact Pad to Center Pad (X20) G1 0.20 |
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