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PIC16F570 Datenblatt(PDF) 128 Page - Microchip Technology |
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PIC16F570 Datenblatt(HTML) 128 Page - Microchip Technology |
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128 / 134 page ![]() PIC16F527 DS40001652C-page 128 2012-2014 Microchip Technology Inc. Microchip Technology Drawing C04-256A Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Number of Terminals Overall Height Terminal Width Overall Width Overall Length Terminal Length Exposed Pad Width Exposed Pad Length Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b D E2 D2 A3 e L E N 0.40 0.127 REF 1.65 1.65 0.30 0.15 0.45 0.00 0.20 3.00 BSC 0.40 1.75 1.75 0.50 0.02 3.00 BSC MILLIMETERS MIN NOM 20 1.85 1.85 0.50 0.25 0.55 0.05 MAX K- 0.20 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad 20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JP) - 3x3x0.50 mm Body [UQFN] |
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