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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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MPC5644BCAMMJ1 Datenblatt(PDF) 54 Page - NXP Semiconductors |
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MPC5644BCAMMJ1 Datenblatt(HTML) 54 Page - NXP Semiconductors |
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54 / 116 page  MPC5646C Microcontroller DataSheet, Rev. 7 Electrical Characteristics NXP Semiconductors 54 4.8 Power management electrical characteristics 4.8.1 Voltage regulator electrical characteristics The device implements an internal voltage regulator to generate the low voltage core supply VDD_LV from the high voltage supply VDD_HV_A. The following supplies are involved: • HV: High voltage external power supply for voltage regulator module. This must be provided externally through VDD_HV_A power pin. • LV: Low voltage internal power supply for core, FMPLL and Flash digital logic. This is generated by the on-chip VREG with an external ballast (BCP68 NPN device). It is further split into four main domains to ensure noise isolation between critical LV modules within the device: — LV_COR: Low voltage supply for the core. It is also used to provide supply for FMPLL through double bonding. — LV_CFLA0/CFLA1: Low voltage supply for the two code Flash modules. It is shorted with LV_COR through double bonding. — LV_DFLA: Low voltage supply for data Flash module. It is shorted with LV_COR through double bonding. — LV_PLL: Low voltage supply for FMPLL. It is shorted to LV_COR through double bonding. Figure 8. Voltage regulator capacitance connection 32 KB 56 KB Split Split CTRL CTRL Split CTRL PD0 (always on domain) PD1 Switchable Domain HPREG LPREG HPVDD LPVDD VDD_LV VSS_LV Off chip BCP68 40 μf HPVDD LPVDD sw1 (<0.1 Ω) 8KB VDD_BV VDD_HV_A VSS_HV 100 nf (FMPLL, Flash) VDD_LV VDD_LV VDD_LV VSS_LV VSS_LV VSS_LV 100 nf 100 nf 100 nf VRC_CTRL (CREGn) Chip Boundary 10 μf (CDEC2) (4 × 10 μf) NPN driver 1) All VSS_LV pins must be grounded, as shown for VSS_HV pin. 1) All VSS_LV pins must be grounded, as shown for VSS_HV pin. |
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