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STM32U595AI Datenblatt(PDF) 366 Page - STMicroelectronics

Teilenummer STM32U595AI
Bauteilbeschribung  Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU,240 DMIPS, up to 4 MB Flash, 2.5 MB SRAM, LTDC, MIPI® DSI
PDF  377 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32U595AI Datenblatt(HTML) 366 Page - STMicroelectronics

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Package information
STM32U59xxx
366/377
DS13633 Rev 1
6.7
WLCSP208 package information
This WLCSP is a 208 balls, 5.38 x 5.47 mm, 0.35 mm pitch, wafer level chip scale package.
Figure 102. WLCSP208 - Outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010. The tolerance of position that controls the location of
the pattern of balls with respect to datums X and Y. For each ball there is a cylindrical tolerance zone ccc
perpendicular to datum Z and located on true position with respect to datums X and Y as defined by e. The
axis perpendicular to datum Z of each ball must lie within this tolerance zone.
F
G
e1
e2 E
E
e
e
D
BOTTOM VIEW
FRONT VIEW
A3
A2
b
D
A2 BALL LOCATION
(4X)
aaa
A2 ORIENTATION
REFERENCE
A2
A
TOP VIEW
SIDE VIEW
A1
DETAIL A
bbb Z
A1
DETAIL A
ROTATED 90
SEATING PLANE
Z
b(208x)
ZX Y
Z
ccc
ddd
eee Z
BUMP
B0DV_WLCSP208_ME_V1



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