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STM32U595AI Datenblatt(PDF) 368 Page - STMicroelectronics |
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STM32U595AI Datenblatt(HTML) 368 Page - STMicroelectronics |
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368 / 377 page ![]() Package information STM32U59xxx 368/377 DS13633 Rev 1 Figure 103. WLCSP208 - Recommended footprint 1. Dimensions are expressed in millimeters. Device marking for WLCSP208 The following figure gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which also depend on supply chain operations, are not indicated below. Figure 104. WLCSP208 marking example (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting Table 164. WLCSP208 - Recommended PCB design rules Dimension Recommended values Pitch 0.35 mm Dpad 0,210 mm Dsm 0.275 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.235 mm Stencil thickness 0.100 mm Dsm Dpad MSv71177V1 Pin 1 identifier Product identification (1) R Y WW 32U599BJ6Q Revision code Date code |
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