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STM32U595AI Datenblatt(PDF) 371 Page - STMicroelectronics |
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STM32U595AI Datenblatt(HTML) 371 Page - STMicroelectronics |
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371 / 377 page ![]() DS13633 Rev 1 371/377 STM32U59xxx Package information 373 Figure 106. TFBGA216 - Recommended footprint eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to four decimal digits. Table 166. TFBGA216 - Recommended PCB design rules (0.8 mm pitch) Dimension Recommended values Pitch 0.8 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm Table 165. TFBGA216 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max BGA_WLCSP_FT_V1 Dsm Dpad |
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