STM32U595AI datasheet(372/377 Pages) STMICROELECTRONICS

372 / 377 page

Package information

STM32U59xxx

372/377

DS13633 Rev 1

Device marking for TFBGA216

The following figure gives an example of topside marking orientation versus ball A1 identifier

location.

The printed markings may differ depending on the supply chain.

Other optional marking or inset/upset marks, which also depend on supply chain operations,

are not indicated below.

Figure 107. TFBGA216 marking example (package top view)

1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified

and therefore not approved for use in production. ST is not responsible for any consequences resulting

from such use. In no event will ST be liable for the customer using any of these engineering samples in

production. ST’s Quality department must be contacted prior to any decision to use these engineering

samples to run a qualification activity.

6.9

Package thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, can be calculated

using the following equation:

TJ max = TA max + (PD max * ΘJA)

where:

•

TA max is the maximum ambient temperature in °C.

•

ΘJA is the package junction-to-ambient thermal resistance in °C/W.

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max).

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

MSv69529V1

MSv71175V1

Revision code

Product

identification

(1)

Ball A1

identifier

Date code

NJH6Q

STM32U599

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