SPRUG18 datasheet(1/214 Pages) TI

Teilenummer	SPRUG18

Bauteilbeschribung	TMS320C6474 Multicore Digital Signal Processor

PDF	214 Pages

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Hersteller	TI [Texas Instruments]

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TMS320C6474

www.ti.com

SPRS552H

– OCTOBER 2008 – REVISED APRIL 2011

TMS320C6474 Multicore Digital Signal Processor

1

Features

12

•

1.2-GHz Device: -40

°C to 95°C(1)

• Key Features

•

1-GHz Device: -40

°C to 100°C

– High-Performance Multicore DSP (C6474)

• 3 TMS320C64x+™ DSP Cores

– Instruction Cycle Time: 0.83 ns (1.2-GHz

Device); 1 ns (1-GHz Device); 1.18 ns

– Dedicated SPLOOP Instructions

(850-MHz Device)

– Compact Instructions (16-Bit)

– Clock Rate: 1 GHz to 1.2 GHz (1.2-GHz

– Exception Handling

Device); 1 GHz (1-GHz Device); 850 MHz

• TMS320C64x+ Megamodule L1 Memory

(850-MHz Device)

Architecture

– Commercial Temperature and Extended

– 256 K-Bit (32 K-Byte) L1P Program Cache

Temperature

[Direct Mapped]

– 3 TMS320C64x+™ DSP Cores; Six RSAs for

– 256 K-Bit (32 K-Byte) L1D Data Cache

CDMA Processing (2 per core)

[2-Way Set-Associative]

– Enhanced VCP2/TCP2

– 512 K-Bit (64 K-Byte) L3 ROM

– Frame Synchronization Interface

• Enhanced VCP2

– 16-/32-Bit DDR2-667 Memory Controller

– Supports Over 694 7.95-Kbps AMR

– EDMA3 Controller

• Enhanced Turbo Decoder Coprocessor (TCP2)

– Antenna Interface

– Supports up to Eight 2-Mbps 3 GPP

– Two 1x Serial RapidIO® Links, v1.2

(6 Iterations)

Compliant

• Endianness: Little Endian, Big Endian

– One 1.8-V Inter-Integrated Circuit (I2C) Bus

• Frame Synchronization Interface

– Two 1.8-V McBSPs

– Time Alignment Between Internal

– 1000 Mbps Ethernet MAC (EMAC)

Subsystems, External Devices/System

– Six 64-Bit General-Purpose Timers

– OBSAI RP1 Compliant for Frame Burst Data

– 16 General-Purpose I/O (GPIO) Pins

– Alternate Interfaces for non-RP1 and

– Internal Semaphore Module

non-UMTS Systems

– System PLL and PLL Controller/DDR PLL

• 16-/32-Bit DDR2-667 Memory Controller

and PLL Controller, Dedicated to DDR2

• EDMA3 Controller (64 Independent Channels)

Memory Controller

• Antenna Interface

• High-Performance Multicore DSP (C6474)

– 6 Configurable Links (Full Duplex)

– Instruction Cycle Time:

– Supports OBSAI RP3 Protocol, v1.0:

•

1.2-GHz Device: 0.83-ns

768-Mbps, 1.536-, 3.072-Gbps Link Rates

•

1-GHz Device: 1-ns

– Supports CPRI Protocol V2.0: 614.4-Mbps,

•

850-MHz Device: 1.18 ns

1.2288-, 2.4576-Gbps Link Rates

– Clock Rate:

– Clock Input Independent or Shared with CPU

(Selectable at Boot-Time)

•

1.2-GHz Device: 1 GHz to 1.2 GHz

• Two 1x Serial RapidIO® Links, v1.2 Compliant

•

1-GHz Device: 1 GHz

– 1.25-, 2.5-, 3.125-Gbps Link Rates

•

850-MHz Device: 850 MHz

– Message Passing and DirectIO Support

– Eight 32-Bit Instructions/Cycle

– Error Management Extensions and

– Commercial Temperature:

Congestion Control

•

1.2-GHz Device: 0

°C to 95°C

• One 1.8-V Inter-Integrated Circuit (I2C) Bus

•

850-MHZ and 1-GHz Device: 0

°C to 100°C

• Two 1.8-V McBSPs

– Extended Temperature:

(1)

Note: Advance Information is presented in this document for

the C6474 1.2-GHz extended temperature device.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

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