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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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SPRUG18 Datenblatt(PDF) 208 Page - Texas Instruments |
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SPRUG18 Datenblatt(HTML) 208 Page - Texas Instruments |
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208 / 214 page  TMS320C6474 SPRS552H – OCTOBER 2008 – REVISED APRIL 2011 www.ti.com 8 Mechanical Data 8.1 Thermal Data Table 8-1 shows the thermal resistance characteristics for the PBGA —CUN/GUN/ZUN—mechanical package. Table 8-1. Thermal Resistance Characteristics (PBGA Package) [CUN/GUN/ZUN](1) AIR FLOW NO. PARAMETER °C/W (m/s)(2) 1 R ΘJC Junction-to-case 0.30 N/A 2 R ΘJB Junction-to-board 6.5 N/A (1) A heatsink is required for proper device operation. (2) m/s = meters per second 8.2 Packaging Information The following packaging information reflects the most current released data available for the designated device(s). This data is subject to change without notice and without revision of this document. 208 Mechanical Data Copyright © 2008–2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s) :TMS320C6474 |
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