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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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SPRUG18 Datenblatt(PDF) 209 Page - Texas Instruments |
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SPRUG18 Datenblatt(HTML) 209 Page - Texas Instruments |
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209 / 214 page  PACKAGE OPTION ADDENDUM www.ti.com 1-Dec-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Samples (Requires Login) TMS320C6474FGUN ACTIVE FCBGA GUN 561 60 TBD SNPB Level-4-220C-72 HR TMS320C6474FGUN2 ACTIVE FCBGA GUN 561 60 TBD SNPB Level-4-220C-72 HR TMS320C6474FGUNA ACTIVE FCBGA GUN 561 60 TBD Call TI Call TI TMS320C6474FZUN NRND FCBGA ZUN 561 60 TBD Call TI Call TI TMS320C6474FZUN2 NRND FCBGA ZUN 561 60 Pb-Free (RoHS Exempt) SNAGCU Level-4-245C-72HR TMS320C6474FZUN8 NRND FCBGA ZUN 561 60 Pb-Free (RoHS Exempt) SNAGCU Level-4-245C-72HR TMS320C6474FZUNA NRND FCBGA ZUN 561 1 Pb-Free (RoHS Exempt) SNAGCU Level-4-245C-72HR TMS320C6474FZUNA2 NRND FCBGA ZUN 561 60 Pb-Free (RoHS Exempt) SNAGCU Level-4-245C-72HR TMS320C6474GUN OBSOLETE FCBGA GUN 561 TBD Call TI Call TI TMS320C6474ZUN OBSOLETE FCBGA ZUN 561 TBD Call TI Call TI TMX320C6474GUN OBSOLETE FCBGA GUN 561 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. |
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