DLPA2000 datasheet(11/63 Pages) TI

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)(1)

MIN

MAX

UNIT

SUPPLY VOLTAGE(2)

V(VDD)

–0.3

1.21

V(VDDLP12)

–0.3

1.32

V(VCC18)

–0.3

1.96

DMD Sub-LVDS Interface (DMD_HS_CLK_x and DMD_HS_WDATA_x_y)

–0.3

1.96

V(VCC_INTF)

–0.3

3.60

V(VCC_FLSH)

–0.3

3.60

V(VDD_PLLM) (MCG PLL)

–0.3

1.21

V(VDD_PLLD) (DCG PLL)

–0.3

1.21

VI2C buffer (I/O type 7)

–0.3

See (3)

GENERAL

Operating junction temperature

–30

125

°C

Tstg

Storage temperature

–40

125

°C

(1)

Stresses beyond those listed under Section 6.1 may cause permanent damage to the device. These are stress ratings only, which do

not imply functional operation of the device at these or any other conditions beyond those indicated under Section 6.3. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to VSS (GND).

(3)

I/O is high voltage tolerant; that is, if VCC_INTF = 1.8 V, the input is 3.3-V tolerant, and if VCC_INTF = 3.3 V, the input is 5-V tolerant.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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