Datenblatt-Suchmaschine für elektronische Bauteile
  German  ▼
ALLDATASHEETDE.COM

X  

CC1020-RTR1 Datenblatt(PDF) 16 Page - Texas Instruments

Teilenummer CC1020-RTR1
Bauteilbeschribung  Single Chip Low Power RF Transceiver for Narrowband Systems
PDF  91 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

CC1020-RTR1 Datenblatt(HTML) 16 Page - Texas Instruments

Back Button CC1020-RTR1 Datasheet HTML 12Page - Texas Instruments CC1020-RTR1 Datasheet HTML 13Page - Texas Instruments CC1020-RTR1 Datasheet HTML 14Page - Texas Instruments CC1020-RTR1 Datasheet HTML 15Page - Texas Instruments CC1020-RTR1 Datasheet HTML 16Page - Texas Instruments CC1020-RTR1 Datasheet HTML 17Page - Texas Instruments CC1020-RTR1 Datasheet HTML 18Page - Texas Instruments CC1020-RTR1 Datasheet HTML 19Page - Texas Instruments CC1020-RTR1 Datasheet HTML 20Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 16 / 91 page
background image
CC1020
SWRS046
Page 16 of 92
Pin no.
Pin name
Pin type
Description
-
AGND
Ground (analog)
Exposed die attached pad. Must be soldered to a solid ground plane as
this is the ground connection for all analog modules. See page 64 for
more details.
1
PCLK
Digital input
Programming clock for SPI configuration interface
2
PDI
Digital input
Programming data input for SPI configuration interface
3
PDO
Digital output
Programming data output for SPI configuration interface
4
DGND
Ground (digital)
Ground connection (0 V) for digital modules and digital I/O
5
DVDD
Power (digital)
Power supply (3 V typical) for digital modules and digital I/O
6
DGND
Ground (digital)
Ground connection (0 V) for digital modules (substrate)
7
DCLK
Digital output
Clock for data in both receive and transmit mode.
Can be used as receive data output in asynchronous mode
8
DIO
Digital input/output
Data input in transmit mode; data output in receive mode
Can also be used to start power-up sequencing in receive
9
LOCK
Digital output
PLL Lock indicator, active low. Output is asserted (low) when PLL is in
lock. The pin can also be used as a general digital output, or as receive
data output in synchronous NRZ/Manchester mode
10
XOSC_Q1
Analog input
Crystal oscillator or external clock input
11
XOSC_Q2
Analog output
Crystal oscillator
12
AVDD
Power (analog)
Power supply (3 V typical) for crystal oscillator
13
AVDD
Power (analog)
Power supply (3 V typical) for the IF VGA
14
LNA_EN
Digital output
General digital output. Can be used for controlling an external LNA if
higher sensitivity is needed.
15
PA_EN
Digital output
General digital output. Can be used for controlling an external PA if
higher output power is needed.
16
AVDD
Power (analog)
Power supply (3 V typical) for global bias generator and IF anti-alias
filter
17
R_BIAS
Analog output
Connection for external precision bias resistor (82 k
Ω, ± 1%)
18
AVDD
Power (analog)
Power supply (3 V typical) for LNA input stage
19
RF_IN
RF Input
RF signal input from antenna (external AC-coupling)
20
AVDD
Power (analog)
Power supply (3 V typical) for LNA
21
RF_OUT
RF output
RF signal output to antenna
22
AVDD
Power (analog)
Power supply (3 V typical) for LO buffers, mixers, prescaler, and first PA
stage
23
AVDD
Power (analog)
Power supply (3 V typical) for VCO
24
VC
Analog input
VCO control voltage input from external loop filter
25
AGND
Ground (analog)
Ground connection (0 V) for analog modules (guard)
26
AD_REF
Power (analog)
3 V reference input for ADC
27
AVDD
Power (analog)
Power supply (3 V typical) for charge pump and phase detector
28
CHP_OUT
Analog output
PLL charge pump output to external loop filter
29
AVDD
Power (analog)
Power supply (3 V typical) for ADC
30
DGND
Ground (digital)
Ground connection (0 V) for digital modules (guard)
31
DVDD
Power (digital)
Power supply connection (3 V typical) for digital modules
32
PSEL
Digital input
Programming chip select, active low, for configuration interface. Internal
pull-up resistor.
Table 11. Pin assignment overview
Note:
DCLK,
DIO
and
LOCK
are
high-
impedance (3-state) in power down
(BIAS_PD = 1 in the MAIN register).
The exposed die attached pad must be
soldered to a solid ground plane as this is
the main ground connection for the chip.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91


Datenblatt Download

Go To PDF Page


Link URL



War ALLDATASHEET hilfreich?  [ DONATE ] 

Über Alldatasheet   |   Werbung   |   Kontakt   |   Privatsphäre und Datenschutz   |   Link zum Datenblatt    |   Linktausch   |   Hersteller
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com