AD9640SLASHPCB datasheet(9/41 Pages) AD

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Preliminary Technical Data

AD9640

Rev. PrD | Page 9 of 41

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

ELECTRICAL

AVDD, DVDD to AGND

−0.3 V to +2.0 V

DRVDD to DRGND

−0.3 V to +3.9 V

AGND to DRGND

−0.3 V to +0.3 V

VIN+A/B, VIN-A/B to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to +3.9V

D0A/B through D13A/B to DRGND

−0.3 V to DRVDD + 0.3 V

FD0A/B through FD3A/B to DRGND

−0.3 V to DRVDD + 0.3 V

DCOA/B to DRGND

−0.3 V to DRVDD + 0.3 V

VREF to AGND

−0.3 V to AVDD + 0.3 V

SENSE to AGND

−0.3 V to AVDD + 0.2 V

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range (Ambient)

−65°C to +150°C

Stresses above those listed under the Absolute Maximum

Ratings may cause permanent damage to the device. This is a

stress rating only; functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the

customer board increases the reliability of the solder joints,

maximizing the thermal capability of the package.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

64 lead LFCSP 9 mm sq.

(CP-64-3)

TBD

°C/W

Typical θJA and θJC are specified for a 4-layer board in still air.

Airflow increases heat dissipation effectively reducing θJA. In

addition, metal in direct contact with the package leads from

metal traces, and through holes, ground, and power planes,

reduces the θJA.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

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