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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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MSP432P411VIPZ Datenblatt(PDF) 45 Page - Texas Instruments |
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MSP432P411VIPZ Datenblatt(HTML) 45 Page - Texas Instruments |
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45 / 212 page  45 MSP432P4111, MSP432P4011, MSP432P411Y MSP432P401Y, MSP432P411V, MSP432P401V www.ti.com SLASEA0A – DECEMBER 2017 – REVISED FEBRUARY 2018 Submit Documentation Feedback Product Folder Links: MSP432P4111 MSP432P4011 MSP432P411Y MSP432P401Y MSP432P411V MSP432P401V Specifications Copyright © 2017–2018, Texas Instruments Incorporated (1) Measured with VCORE = 1.2 V. 5.24 Current Consumption of Digital Peripherals over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER TEST CONDITIONS TYP MAX UNIT ITIMER_A Timer_A configured as PWM timer with 50% duty cycle 5 µA/MHz ITIMER32 Timer32 enabled 3.5 µA/MHz IUART eUSCI_A configured in UART mode 6.5 µA/MHz ISPI eUSCI_A configured in SPI master mode 5 µA/MHz II2C eUSCI_B configured in I2C master mode 5 µA/MHz IWDT_A WDT_A configured in interval timer mode 6 µA/MHz IRTC_C RTC_C enabled and sourced from 32-kHz LFXT 100 nA IAES256 AES256 active 19 µA/MHz ICRC32 CRC32 active 2 µA/MHz (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC (RθJC) value, which is based on a JEDEC-defined 1S0P system) and will change based on environment and application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (3) N/A = Not applicable 5.25 Thermal Resistance Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) THERMAL METRIC(1) PACKAGE VALUE(2) (3) UNIT RθJA Junction-to-ambient thermal resistance, still air LQFP-100 (PZ) 44.5 °C/W RθJC(TOP) Junction-to-case (top) thermal resistance 6.4 °C/W RθJB Junction-to-board thermal resistance 22.0 °C/W ΨJB Junction-to-board thermal characterization parameter 21.7 °C/W ΨJT Junction-to-top thermal characterization parameter 0.2 °C/W RθJC(BOTTOM) Junction-to-case (bottom) thermal resistance N/A °C/W RθJA Junction-to-ambient thermal resistance, still air QFN-64 (RGC) 28.2 °C/W RθJC(TOP) Junction-to-case (top) thermal resistance 7.7 °C/W RθJB Junction-to-board thermal resistance 6.8 °C/W ΨJB Junction-to-board thermal characterization parameter 6.7 °C/W ΨJT Junction-to-top thermal characterization parameter 0.1 °C/W RθJC(BOTTOM) Junction-to-case (bottom) thermal resistance 0.7 °C/W |
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