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MSP432P411VIPZ Datenblatt(PDF) 46 Page - Texas Instruments

Teilenummer MSP432P411VIPZ
Bauteilbeschribung  SimpleLink Mixed-Signal Microcontrollers
PDF  212 Pages
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MSP432P411VIPZ Datenblatt(HTML) 46 Page - Texas Instruments

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MSP432P4111, MSP432P4011, MSP432P411Y
MSP432P401Y, MSP432P411V, MSP432P401V
SLASEA0A – DECEMBER 2017 – REVISED FEBRUARY 2018
www.ti.com
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Product Folder Links: MSP432P4111 MSP432P4011 MSP432P411Y MSP432P401Y MSP432P411V MSP432P401V
Specifications
Copyright © 2017–2018, Texas Instruments Incorporated
5.26 Timing and Switching Characteristics
5.26.1 Reset Timing
Table 5-1 lists the latencies to recover from different types of resets.
(1)
See Section 6.8.1 for details on the various classes of resets on the device
Table 5-1. Reset Recovery Latencies
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(1)
PARAMETER
MIN
TYP
MAX
UNIT
tSOFT
Latency from release of soft reset to first CPU instruction fetch
5
MCLK
cycles
tHARD
Latency from release of hard reset to release of soft reset
25
MCLK
cycles
tPOR
Latency from release of device POR to release of hard reset
15
25
µs
tCOLDPWR, 100nF
Latency from a cold power-up condition to release of device POR, CVCORE = 100 nF
300
400
µs
tCOLDPWR, 4.7µF
Latency from a cold power-up condition to release of device POR, CVCORE = 4.7 µF
400
500
µs
Table 5-2 lists the latencies to recover from an external reset applied on RSTn pin.
(1)
External reset is applied on RSTn pin, and the latency is measured from release of external reset to start of user application code.
Table 5-2. External Reset Recovery Latencies(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
tAM_RSTn
External reset applied when device is in LDO-based or DC/DC-based active
modes,
MCLK = 1 to 48 MHz
4.5
ms
tAMLF_RSTn, 128 kHz
External reset applied when device is in low-frequency active modes,
MCLK = 128 kHz
5
ms
tAMLF_RSTn, 32 kHz
External reset applied when device is in low-frequency active modes,
MCLK = 32.768 kHz
6
ms
tLPM0_RSTn
External reset applied when device is in LDO-based or DC/DC-based LPM0
modes,
MCLK = 1 to 48 MHz
4.5
ms
tLPM0LF_RSTn, 128 kHz
External reset applied when device is in low-frequency LPM0 modes,
MCLK = 128 kHz
5
ms
tLPM0LF_RSTn, 32 kHz
External reset applied when device is in low-frequency LPM0 modes,
MCLK = 32.768 kHz
6
ms
tLPM3_LPM4_RSTn
External reset applied when device is in LPM3 or LPM4 modes,
MCLK = 24 or 48 MHz while entering LPM3 or LPM4 modes
4.5
ms
tLPMx.5_RSTn
External reset applied when device is in LPM3.5 or LPM4.5 modes
4.5
ms
5.26.2 Peripheral Register Access Timing
Table 5-3 lists the latency involved when CPU performs read or write access to peripheral registers.
(1)
The bridge that connects CPU to peripherals runs at half of the speed of the CPU.
(2)
The maximum value depends on the previous opcode executing in the CPU pipeline and the status of the bus (idle or busy performing
data access).
Table 5-3. Peripheral Register Access Latency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
MIN
MAX
UNIT
treg_access
Number of CPU clock cycles required for read or write access to peripheral registers
2(1)
5(2)
MCLK
cycles



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