MSP432P411VIPZ datasheet(1/212 Pages) TI1

Teilenummer	MSP432P411VIPZ

Bauteilbeschribung	SimpleLink Mixed-Signal Microcontrollers

PDF	212 Pages

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Hersteller	TI1 [Texas Instruments]

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

MSP432P4111, MSP432P4011, MSP432P411Y

MSP432P401Y, MSP432P411V, MSP432P401V

SLASEA0A – DECEMBER 2017 – REVISED FEBRUARY 2018

MSP432P411x, MSP432P401x SimpleLink™ Mixed-Signal Microcontrollers

1

Device Overview

1

1.1

Features

1

• Core

– Arm® 32-Bit Cortex®-M4F CPU With Floating

Point Unit and Memory Protection Unit

– Frequency up to 48 MHz

– ULP Benchmark

– 150.6 ULPBench™-CP

Performance Benchmark

– 3.41 CoreMark/MHz

– 1.22 DMIPS/MHz (Dhrystone 2.1)

• Advanced Low-Power Analog Features

– SAR Analog-To-Digital Converter (ADC) With

16-Bit Precision and up to 1 Msps

– Differential and Single-Ended Inputs

– Two Window Comparators

– Up to 24 Input Channels

– Internal Voltage Reference With 25-ppm/°C

Typical Stability

– Two Analog Comparators

– Integrated LCD Driver With Contrast Control for

up to 320 Segments

• Memories

– Up to 2048KB of Flash Main Memory

(Organized Into Two Banks Enabling

Simultaneous Read or Execute During Erase)

– 32KB of Flash Information Memory (Including

area used for BSL, TLV, and Flash Mailbox)

– Up to 256KB of SRAM (Including 8KB of

Backup Memory)

– 2KB of Utility SRAM

– 32KB of ROM with MSP432™ Peripheral Driver

Libraries

• Ultra-Low-Power Operating Modes

– Active: 100 µA/MHz

– Low-Frequency Active: 95 µA (at 128 kHz)

– LPM3 (With RTC): 820 nA

– LPM3.5 (With RTC): 820 nA

– LPM4: 690 nA

– LPM4.5: 22 nA

• SimpleLink™ Platform

– Support for Bluetooth® Low Energy, Wi-Fi®, and

Sub-1 GHz

– Single Development Environment

– 100% Code Reuse Across SimpleLink SDK

• Operating Characteristics

– Wide Supply Voltage Range: 1.62 V to 3.7 V

– Temperature Range (Ambient): –40°C to 85°C

• Flexible Clocking Features

– Programmable Internal DCO (up to 48 MHz)

– 32.768-kHz Low-Frequency Crystal (LFXT)

– High-Frequency Crystal (HFXT) up to 48 MHz

– Low-Frequency Trimmed Internal Reference

Oscillator (REFO)

– Very-Low-Power Low-Frequency Internal

Oscillator (VLO)

– Module Oscillator (MODOSC)

– System Oscillator (SYSOSC)

• Code Security Features

– JTAG and SWD Lock

– IP Protection (up to Four Secure Flash Zones,

Each With Configurable Start Address and Size)

• Enhanced System Options

– Programmable Supervision and Monitoring of

Supply Voltage

– Multiple-Class Resets for Better Control of

Application and Debug

– 8-Channel DMA

– RTC With Calendar and Alarm Functions

• Timing and Control

– Up to Four 16-Bit Timers, Each With up to Five

Capture, Compare, PWM Capability

– Two 32-Bit Timers with Interrupt Generation

Capability

• Serial Communication

– Up to Four eUSCI_A Modules

– UART With Automatic Baud-Rate Detection

– IrDA Encode and Decode

– SPI (up to 16 Mbps)

– Up to Four eUSCI_B Modules

– I2C (With Multiple-Slave Addressing)

– SPI (up to 16 Mbps)

• Flexible I/O Features

– Ultra-Low-Leakage I/Os (±20 nA Maximum)

– All I/Os With Capacitive Touch Capability

– Up to 48 I/Os With Interrupt and Wake-up

Capability

– Up to 24 I/Os With Port Mapping Capability

– Eight I/Os With Glitch Filtering Capability

• Encryption and Data Integrity Accelerators

– 128-, 192-, or 256-Bit AES Encryption and

Decryption Accelerator

– 32-Bit Hardware CRC Engine

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