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FS26 Datenblatt(PDF) 19 Page - NXP Semiconductors

Teilenummer FS26
Bauteilbeschribung  Safety system basis chip with low power for ASIL D/ASIL B
PDF  156 Pages
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Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
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FS26 Datenblatt(HTML) 19 Page - NXP Semiconductors

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NXP Semiconductors
FS26
Safety system basis chip with low power for ASIL D/ASIL B
11 Thermal ratings
Symbol
Description
Min
Typ
Max
Unit
TA
Ambient temperature
-40
—
125
°C
TJ
Junction temperature
-40
—
150
°C
TSTG
Storage temperature
-55
—
150
°C
TWARN
Temperature warning threshold to set TWARN_S bit
145
155
170
°C
Table 6. Temperatures ranges
Symbol
Description
Value
Unit
RθJA
Thermal resistance Junction to Ambient[1]
25
°C/W
RθJCBOTTOM
Thermal resistance Junction to Case Bottom[2][3]
(with uniform power dissipation on the silicon die)
1.7
°C/W
RθJCTOP
Thermal resistance Junction to Case Top[1]
13.5
°C/W
ΨJT
Thermal characterization parameter Junction to Top[4]
0.8
°C/W
Table 7. Thermal resistance (per JEDEC JESD51-2)
[1]
Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal
performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an
application-specific environment.
[2]
Thermal resistance between the die and the printed circuit board. Board temperature is measured on the top surface of the board near the package.
[3]
For exposed pad packages where the pad would be expected to be soldered, junction to case thermal resistance is a simulated value from the junction to
the exposed pad without contact resistance.
[4]
Thermal test board meets JEDEC specification for this package (JESD51-7).
FS26_SDS
All information provided in this document is subject to legal disclaimers.
© 2025 NXP B.V. All rights reserved.
Product short data sheet
Rev. 6.0 — 12 December 2025
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