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FS26 Datenblatt(PDF) 5 Page - NXP Semiconductors |
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FS26 Datenblatt(HTML) 5 Page - NXP Semiconductors |
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5 / 156 page ![]() NXP Semiconductors FS26 Safety system basis chip with low power for ASIL D/ASIL B 3 Features and benefits Operating range • 40 V DC maximum input voltage • Supports operating voltage range down to battery 3.2 V with VBST in front-end • Supports operating voltage range down to battery 6 V without VBST in front-end • Low-power LPOFF mode with 30 µA quiescent current • Low-power standby mode with 29 µA quiescent current with VPRE active. LDO1 or LDO2 activation selectable via OTP configuration. GPIO1 or GPIO2 activation selectable via SPI communication. Power supplies • VPRE: Synchronous buck converter with integrated FETs. Configurable output voltage and switching frequency, output DC current capability up to 1.5 A and PFM mode for Low-power standby mode operation. • VCORE: Synchronous buck converter with integrated FETs. VCORE is dedicated for microcontroller core supply. Output DC current up to 0.8 A or 1.65 A (depending on part number), output voltage range setting from 0.8 V to 3.35 V. • VBST: Asynchronous boost controller with external low-side switch, diode, and current sense resistor. VBST is configurable as front-end supply to withstand low voltage cranking profiles or in back-end supply with configurable output voltage and scalable output DC current capability. • LDO1: LDO regulator for microcontroller I/O support with selectable output voltage between 3.3 V and 5.0 V and up to 400 mA current capability. • LDO2: LDO regulator for system peripheral support with selectable output voltage between 3.3 V and 5.0 V and up to 400 mA current capability. • VREF: High-precision reference voltage with 0.75 % accuracy for External ADC reference and internal tracking reference. • TRK1 and TRK2: Voltage tracking regulators with selectable output voltage between VREF, LDO2, or Internal LDO reference. Supports high-voltage protection for ECU off- board operation. Each tracker has a current capability up to 150 mA. System support • Two wake-up inputs with high-voltage support for system robustness • Two programmable GPIO with wake-up capability or HS/LS driver • Programmable long duration timer (LDT) for system shutdown and wake-up control • Monitoring of system voltages (Including Battery voltage monitoring) through the analog multiplexer • Selectable wake-up sources from: WAKE/GPIO pins, LDT, or SPI activity • Device control via 32-bit SPI interface with cyclic redundancy checks (CRC) Compliance • Electromagnetic compatibility (EMC) optimization techniques for switching regulators, including spread spectrum, slew rate control, and manual frequency tuning. • Electromagnetic interference (EMI) robustness supporting various automotive EMI test standards. Functional safety • Scalable portfolio from automotive safety integrity levels (ASIL) B to D • Independent monitoring circuitry, dedicated interface for microcontroller monitoring, simple or challenger watchdog function • Analog built-in self-test (ABIST1) and logical built-in self-test (LBIST) at startup • Analog built-in self-test (ABIST2) on demand • Safety outputs with latent fault detection mechanism (RSTB, FS0B, FS1B) FS26_SDS All information provided in this document is subject to legal disclaimers. © 2025 NXP B.V. All rights reserved. Product short data sheet Rev. 6.0 — 12 December 2025 Document feedback 5 / 156 |
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