28HS01GTAM03 datasheet(133/138 Pages) INFINEON

133 / 138 page

Datasheet

133 of 138

002-18216 Rev. *W

2022-01-18

256Mb/512Mb/1Gb SEMPER™ Flash

Octal interface, 1.8V/3.0V

Package diagrams

Figure 82

Ball grid array 24-ball 8  8 mm (VAC024)

N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" = eD/2 AND "SE" = eE/2.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW "SD" OR "SE" = 0.

POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.

"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.

"e" REPRESENTS THE SOLDER BALL GRID PITCH.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.

BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.

DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION

NOTES:

ALL DIMENSIONS ARE IN MILLIMETERS.

0.35

0.00 BSC

1.00 BSC

0.40

0.45

0.20

4.00 BSC

8.00 BSC

1.00

0.00 BSC

DIMENSIONS

SYMBOL

MIN.

NOM.

MAX.

OR OTHER MEANS.

JEDEC SPECIFICATION NO. REF: N/A

10.

002-22282 **

28HS01GTAM03 Datenblatt(PDF) 133 Page - Infineon Technologies AG

28HS01GTAM03 Datenblatt(HTML) 133 Page - Infineon Technologies AG

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datenblatt Download

Link URL