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FS26 Datenblatt(PDF) 154 Page - NXP Semiconductors

Teilenummer FS26
Bauteilbeschribung  Safety system basis chip with low power for ASIL D/ASIL B
PDF  156 Pages
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FS26 Datenblatt(HTML) 154 Page - NXP Semiconductors

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NXP Semiconductors
FS26
Safety system basis chip with low power for ASIL D/ASIL B
Figures
Fig. 1.
Functional block diagram .................................. 4
Fig. 2.
Example of application diagram with VBST
as a front-end regulator .................................... 7
Fig. 3.
Example of application diagram with VBST
as a back-end regulator .................................... 8
Fig. 4.
Part number breakdown ....................................9
Fig. 5.
Part number mapping versus features set .........9
Fig. 6.
Block diagram of the FS26 ..............................14
Fig. 7.
Pin assignment in LQFP48 package with
exposed pad ....................................................15
Fig. 8.
Input voltage range in normal mode ................23
Fig. 9.
Input voltage range in standby mode and
LPOFF mode () ...............................................24
Fig. 10.
Battery current consumption in standby
mode (LDO1 and LDO2 disabled) ...................26
Fig. 11.
LDOx current consumption in standby
mode ............................................................... 26
Fig. 12.
Total battery current consumption in
standby mode ..................................................27
Fig. 13.
Battery current consumption in standby
mode with VPRE_PFM = 3.70 V or 5.35 V
and LDOx disabled ......................................... 28
Fig. 14.
Application flowchart ....................................... 31
Fig. 15.
Input topology: front-end boost controller ........ 32
Fig. 16.
Input topology: direct VSUP connection .......... 32
Fig. 17.
Power-up example with VBST as front-end
supply .............................................................. 34
Fig. 18.
Power-up example with direct battery
supply .............................................................. 35
Fig. 19.
Power-down example with VBST as front-
end supply .......................................................36
Fig. 20.
SPI write operation protocol ............................37
Fig. 21.
SPI read operation protocol ............................ 37
Fig. 22.
CRC encoder example ....................................39
Fig. 23.
SPI timing diagram ..........................................41
Fig. 24.
VPRE schematic with connection to VSUP ..... 88
Fig. 25.
VPRE efficiency at VPRE_CLK_OTP = 0 ........92
Fig. 26.
VPRE efficiency at VPRE_CLK_OTP = 1 ........93
Fig. 27.
VBST schematic with configuration from
VPRE ...............................................................96
Fig. 28.
VBST efficiency in back-end mode ................. 99
Fig. 29.
VCORE schematic ........................................ 100
Fig. 30.
VCORE efficiency ..........................................103
Fig. 31.
LDOx block diagram ......................................104
Fig. 32.
VREF block diagram ..................................... 107
Fig. 33.
TRK1 and TRK2 block diagram .................... 109
Fig. 34.
Clock management block diagram ................ 111
Fig. 35.
Clock phase shifting examples ......................112
Fig. 36.
AMUX block diagram .................................... 113
Fig. 37.
WAKEx pin block diagram .............................115
Fig. 38.
GPIO1 block diagram ....................................117
Fig. 39.
GPIO2 block diagram ....................................117
Fig. 40.
GPIO low-side active high operation.
GPIOx_MODE_OTP = 0 ............................... 118
Fig. 41.
GPIO High-side Active High operation.
GPIOx_MODE_OTP = 0 ............................... 119
Fig. 42.
GPIO Push-pull Active High operation.
GPIOx_MODE_OTP = 0 ............................... 120
Fig. 43.
GPIO low-side driver Active Low operation.
GPIOx_MODE_OTP = 1 ............................... 121
Fig. 44.
VCORE PGOOD load switch ........................ 122
Fig. 45.
Long Duration Timer block diagram .............. 125
Fig. 46.
Long Duration Timer functions ...................... 128
Fig. 47.
Long duration timer state machine ................129
Fig. 48.
OTP mode time chart ....................................130
Fig. 49.
Debug mode time chart .................................131
Fig. 50.
OTP mode flowchart until safety outputs
release ...........................................................132
Fig. 51.
Debug mode flowchart until safety outputs
release ...........................................................133
Fig. 52.
Application schematic in front-end
configuration for FPRE = 450 kHz .................134
Fig. 53.
Application schematic in back-end
configuration for FPRE = 450 kHz .................135
Fig. 54.
SOT1571-6 ....................................................142
Fig. 55.
Package outline details (SOT1571-6) ............143
Fig. 56.
Package outline notes (SOT1571-6) ............. 144
Fig. 57.
PCB design guidelines - solder mask
opening pattern (SOT1571-6) ....................... 145
Fig. 58.
PCB design guidelines - I/O pads and
solderable area (SOT1571-6) ........................146
Fig. 59.
PCB design guidelines - solder paste
stencil (SOT1571-6) ...................................... 147
FS26_SDS
All information provided in this document is subject to legal disclaimers.
© 2025 NXP B.V. All rights reserved.
Product short data sheet
Rev. 6.0 — 12 December 2025
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