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FS26 Datenblatt(PDF) 154 Page - NXP Semiconductors |
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FS26 Datenblatt(HTML) 154 Page - NXP Semiconductors |
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154 / 156 page ![]() NXP Semiconductors FS26 Safety system basis chip with low power for ASIL D/ASIL B Figures Fig. 1. Functional block diagram .................................. 4 Fig. 2. Example of application diagram with VBST as a front-end regulator .................................... 7 Fig. 3. Example of application diagram with VBST as a back-end regulator .................................... 8 Fig. 4. Part number breakdown ....................................9 Fig. 5. Part number mapping versus features set .........9 Fig. 6. Block diagram of the FS26 ..............................14 Fig. 7. Pin assignment in LQFP48 package with exposed pad ....................................................15 Fig. 8. Input voltage range in normal mode ................23 Fig. 9. Input voltage range in standby mode and LPOFF mode () ...............................................24 Fig. 10. Battery current consumption in standby mode (LDO1 and LDO2 disabled) ...................26 Fig. 11. LDOx current consumption in standby mode ............................................................... 26 Fig. 12. Total battery current consumption in standby mode ..................................................27 Fig. 13. Battery current consumption in standby mode with VPRE_PFM = 3.70 V or 5.35 V and LDOx disabled ......................................... 28 Fig. 14. Application flowchart ....................................... 31 Fig. 15. Input topology: front-end boost controller ........ 32 Fig. 16. Input topology: direct VSUP connection .......... 32 Fig. 17. Power-up example with VBST as front-end supply .............................................................. 34 Fig. 18. Power-up example with direct battery supply .............................................................. 35 Fig. 19. Power-down example with VBST as front- end supply .......................................................36 Fig. 20. SPI write operation protocol ............................37 Fig. 21. SPI read operation protocol ............................ 37 Fig. 22. CRC encoder example ....................................39 Fig. 23. SPI timing diagram ..........................................41 Fig. 24. VPRE schematic with connection to VSUP ..... 88 Fig. 25. VPRE efficiency at VPRE_CLK_OTP = 0 ........92 Fig. 26. VPRE efficiency at VPRE_CLK_OTP = 1 ........93 Fig. 27. VBST schematic with configuration from VPRE ...............................................................96 Fig. 28. VBST efficiency in back-end mode ................. 99 Fig. 29. VCORE schematic ........................................ 100 Fig. 30. VCORE efficiency ..........................................103 Fig. 31. LDOx block diagram ......................................104 Fig. 32. VREF block diagram ..................................... 107 Fig. 33. TRK1 and TRK2 block diagram .................... 109 Fig. 34. Clock management block diagram ................ 111 Fig. 35. Clock phase shifting examples ......................112 Fig. 36. AMUX block diagram .................................... 113 Fig. 37. WAKEx pin block diagram .............................115 Fig. 38. GPIO1 block diagram ....................................117 Fig. 39. GPIO2 block diagram ....................................117 Fig. 40. GPIO low-side active high operation. GPIOx_MODE_OTP = 0 ............................... 118 Fig. 41. GPIO High-side Active High operation. GPIOx_MODE_OTP = 0 ............................... 119 Fig. 42. GPIO Push-pull Active High operation. GPIOx_MODE_OTP = 0 ............................... 120 Fig. 43. GPIO low-side driver Active Low operation. GPIOx_MODE_OTP = 1 ............................... 121 Fig. 44. VCORE PGOOD load switch ........................ 122 Fig. 45. Long Duration Timer block diagram .............. 125 Fig. 46. Long Duration Timer functions ...................... 128 Fig. 47. Long duration timer state machine ................129 Fig. 48. OTP mode time chart ....................................130 Fig. 49. Debug mode time chart .................................131 Fig. 50. OTP mode flowchart until safety outputs release ...........................................................132 Fig. 51. Debug mode flowchart until safety outputs release ...........................................................133 Fig. 52. Application schematic in front-end configuration for FPRE = 450 kHz .................134 Fig. 53. Application schematic in back-end configuration for FPRE = 450 kHz .................135 Fig. 54. SOT1571-6 ....................................................142 Fig. 55. Package outline details (SOT1571-6) ............143 Fig. 56. Package outline notes (SOT1571-6) ............. 144 Fig. 57. PCB design guidelines - solder mask opening pattern (SOT1571-6) ....................... 145 Fig. 58. PCB design guidelines - I/O pads and solderable area (SOT1571-6) ........................146 Fig. 59. PCB design guidelines - solder paste stencil (SOT1571-6) ...................................... 147 FS26_SDS All information provided in this document is subject to legal disclaimers. © 2025 NXP B.V. All rights reserved. Product short data sheet Rev. 6.0 — 12 December 2025 Document feedback 154 / 156 |
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