FS26 datasheet(106/156 Pages) NXP

106 / 156 page

NXP Semiconductors

FS26

Safety system basis chip with low power for ASIL D/ASIL B

TA = –40 °C to 125 °C, unless otherwise specified. VSUP_UVH < VSUP < 36 V, VPRE_PWM + VPRE_HDR < VSUP_PWR < 36 V,

unless otherwise specified. All voltages are referenced to ground.

Symbol

Description

Min

Typ

Max

Unit

VLDOx_LOTR

Transient load response

ILDOx = 10 mA to 200 mA step and 200 mA to 10 mA

di/dt = 100 mA/µs

COUT_LDOx = 4.7 µF, CIN_LDO = 1 µF

-3

—

VLDOx_LOTR_STBY_HI Transient load response in standby mode

ILDOx = 10 mA to 100 mA step and 100 mA to 10 mA

di/dt = 100 mA/µs

VPRE_PFM = 5.35 V, VLDOx = 5 V

COUT_LDOx = 4.7 µF, CIN_LDO = 1 µF

-100

—

100

VLDOx_LOTR_STBY_

[1]

Transient load response in standby mode with reduced

headroom

ILDOx = 10 µA to 10 mA step and 10 µA to 10 mA

di/dt = 10 mA/µs

VPRE_PFM = 5.05 V , VLDOx = 5 V

COUT_LDOx = 4.7 µF , CIN_LDO = 1 µF

-1.5

—

1.5

tON_LDOx

Turn on rise time (soft start ramp)

—

500

µs

External components

CIN_LDO

Effective[2] input capacitor (close to LDOIN pin)

0.5

—

µF

COUT_LDOx

Effective[2] output capacitance

2.35

4.7

µF

Table 108. LDOx Electrical characteristics...continued

[1]

For all these parameters, the maximum ambient temperature is TA = 85 °C.

[2]

For all regulators, the effective capacitor value is the capacitor value after tolerance, DC bias and aging removal.

FS26_SDS

All information provided in this document is subject to legal disclaimers.

Product short data sheet

Rev. 6.0 — 12 December 2025

Document feedback

106 / 156

FS26 Datenblatt(PDF) 106 Page - NXP Semiconductors

FS26 Datenblatt(HTML) 106 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datenblatt Download

Link URL