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FS26 Datenblatt(PDF) 141 Page - NXP Semiconductors |
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FS26 Datenblatt(HTML) 141 Page - NXP Semiconductors |
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141 / 156 page ![]() NXP Semiconductors FS26 Safety system basis chip with low power for ASIL D/ASIL B 23 Packaging 23.1 Package mechanical dimensions Package dimensions are provided in package drawings. To find the most current package outline drawing, go to http://www.nxp.com and perform a keyword search for the drawing’s document number. Package Suffix Package outline drawing number 7.0 × 7.0, 48–Pin LQFP exposed pad, with 0.5 mm pitch, and a 4.5 × 4.5 exposed pad AE 98ASA00945D Table 128. Package mechanical dimensions FS26_SDS All information provided in this document is subject to legal disclaimers. © 2025 NXP B.V. All rights reserved. Product short data sheet Rev. 6.0 — 12 December 2025 Document feedback 141 / 156 |
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