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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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FS26 Datenblatt(PDF) 135 Page - NXP Semiconductors |
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FS26 Datenblatt(HTML) 135 Page - NXP Semiconductors |
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135 / 156 page  NXP Semiconductors FS26 Safety system basis chip with low power for ASIL D/ASIL B 21.2 Back-end configuration aaa-047639 GPIO1 as global INPUT GPIO2 as local OUTPUT FCCU by pair, FCCU12_FLT_POL = 1 VDIG 21 DEBUG 31 NC 38 WAKE1 47 WAKE2 2 CVDIG GND GND GND GLOBAL_WAKE1 1 µF CSENSE GND 1 µF COUT_AMUX GND VDDIO FS0B 2200 pF GPIO2 6 AMUX 29 COUT_GPIO2 LOCAL_GPIO2 GND 0.01 µF FS0B 13 TRKIN VPRE VREF CIN_TRK LCORE 1 2 1.0 µH 1 µF 7 RFILT2 5.1 kΩ VDDIO RPU_FS0B 10 kΩ LOCAL_WAKE2 RFILT CIN1_WAKE1 0.022 µF CIN2_WAKE1 0.01 µF CIN2_WAKE2 0.01 µF 5.1 kΩ MCU_ADC GND GND GND GPIO1 3 GLOBAL_GPIO1 MISO MCU_MISO 25 MOSI MCU_MOSI 26 SCLK MCU_CLK 27 CSB MCU_CSB 28 INTB MCU_INTB 24 RSTB MCU_RSTB 16 FCCU2 MCU_FCCU2 18 VMONCORE VCORE 15 19 VMONEXT GNDFS 20 GND VMON_INPUT 14 FCCU1 MCU_FCCU1 17 VDDIO VDDIO 3.3 V or 5 V can come from any regulator 23 RAMUX RPU_FCCU1 5.1 kΩ 220 Ω RBST_PG_PU 10 kΩ RSENSE 5.1 kΩ CBAT1 47 µF GND GND CPI3 0.1 µF GND CPI1 10 µF GND CPI2 10 µF GND COUT1_BST 22 µF GND COUT2_BST 22 µF GND CPI4 0.1 µF GND GND GND CIN1_BST 22 µF CIN2_BST 22 µF PMEG050V150EPD DBAT RPD_FCCU2 22 kΩ COUT_INTB 4700 pF COUT_RSTB 1000 pF RPU_RSTB 5.1 kΩ CIN_VDDIO 0.1 µF GND COUT1_FS0B 0.01 µF GND COUT2_FS0B 0.022 µF FS1B FS1B VMON_INPUT * RL/(RL+RH) = 0.8 V 12 RFILT3 5.1 kΩ VDDIO RSNS_BST 0.1 Ω QBST PMV3OUN2 RIP 1 kΩ BZX384-B30 DIP RPU_FS1B 10 kΩ RH RL GND GND GND COUT1_FS1B 0.01 µF GND COUT1_VREF 2.2 µF OPTIONAL OUTPUT CAPACITORS GND COUT1_TRK1 2.2 µF GND CIN_LDO 1 µF COUT1_CORE 22 µF COUT2_CORE 22 µF COUT3_CORE 0.1 µF GND COUT1_LDO2 4.7 µF GND COUT1_LDO1 4.7 µF COUT1_TRK2 2.2 µF GND COUT2_VREF 1000 pF GND COUT2_TRK1 1000 pF GND COUT2_TRK2 1000 pF GND COUT2_LDO1 1000 pF GND COUT2_LDO2 1000 pF GND COUT2_FS1B 0.022 µF RFILT1 CIN1_GPIO1 0.022 µF CIN2_GPIO1 0.01 µF 5.1 kΩ FS26 2 3 OPTIONAL C A VBST_G VPRE VBST_ISH Independent boost - Back end 1 49 EP 22 GNDSUB MFS2633AMDA0AD GND GND CBOOT_CORE 0.047 µF CIN2_CORE 0.01 µF CORE_SW 32 VREF 8 VCORE VTRK1 TRK1 4 VTRK2 TRK2 5 VPRE LDOIN 10 VLDO1 LDO1OUT 11 VLDO2 LDO2OUT 9 CORE_FB 30 CORE_BT 33 CORE_IN VPRE CIN1_CORE LPRE 1 2 10 µH 10 µF 34 COUT1_PRE 22 µF COUT2_PRE 22 µF COUT3_PRE 0.1 µF GND GND GND GND COUT_PG 1000 pF 1 GND VBST CBOOT_PRE VPRE_SW 40 VPRE VMON_PRE 36 VPRE_FB 37 VPRE_BT 39 CBOS 4.7 µF VBOS 35 GND VDDIO VSUP VBAT CSUP 4.7 µF VSUP 42 VBST_PG VBST 43 VBST_FB 44 VBST_ISL 45 VBST_G 46 VBST_ISH 48 BATSENSE CSUP_PWR2 0.1 µF CSUP_PWR1 4.7 µF VSUP_PWR VBST 41 VBST LBST 1 2 D G S 4.7 µH NRVTS245ESFT1G DBST C A LPI 1 2 1.0 µH VBST_ISL Figure 53. Application schematic in back-end configuration for FPRE = 450 kHz FS26_SDS All information provided in this document is subject to legal disclaimers. © 2025 NXP B.V. All rights reserved. Product short data sheet Rev. 6.0 — 12 December 2025 Document feedback 135 / 156 |
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